Universial energy conditioning interposer with circuit architecture

ABSTRACT

The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.

TECHNICAL FIELD

[0001] This application is a continuation-in-part of application Ser.No. 09/594,447 filed Jun. 15, 2000, which is a continuation-in-part ofapplication Ser. No. 09/579,606 filed May 26, 2000, which is acontinuation-in-part of application Ser. No. 09/460,218 filed Dec. 13,1999, which is a continuation of application Ser. No. 09/056,379 filedApr. 7, 1998, now issued as U.S. Pat. No. 6,018,448, which is acontinuation-in-part of application Ser. No. 09/008,769 filed Jan. 19,1998, now issued as U.S. Pat. No. 6,097,581, which is acontinuation-in-part of application Ser. No. 08/841,940 filed Apr. 8,1997, now issued as U.S. Pat. No. 5,909,350. This application alsoclaims the benefit of U.S. Provisional Application No. 60/146,987 filedAug. 3, 1999, U.S. Provisional Application No. 60/165,035 filed Nov. 12,1999, U.S. Provisional Application No. 60/180,101 filed Feb. 3, 2000,U.S. Provisional Application No. 60/185,320 filed Feb. 28, 2000, U.S.Provisional Application No. 60/191,196 filed Mar. 22, 2000, U.S.Provisional Application No. 60/200,327 filed Apr. 28, 2000, U.S.Provisional Application No. 60/203,863 filed May 12, 2000, and U.S.Provisional Application No. 60/215,314 filed Jun. 30, 2000.

[0002] The present invention relates to a circuit interposer comprisinga multilayer, universal, multi-functional, common conductive shieldstructure with conductive pathways for energy and EMI conditioning andprotection that possesses a commonly shared and centrally positionedconductive pathway or electrode that simultaneously shields and allowssmooth energy transfers such as decoupling operations between groupedand energized conductive pathways. The invention is for energyconditioning as it relates to integrated circuit (IC) device packagingor direct mounted IC modules, and more specifically, for interconnectingenergy utilizing integrated circuit chips to a printed circuit board,(IC) device packaging or direct mounted IC modules as a interconnectionmedium between ICs and their component packaging and/or external energycircuit connections or other substrates containing energy pathwaysleading to and from an energy source and an energy utilizing load.

[0003] More specifically, the present invention allows paired orneighboring conductive pathways or electrodes to operate with respect toone another in a harmonious fashion, yet in an oppositely phased orcharged manner, respectively. The invention will provide energyconditioning in such forms of EMI filtering and surge protection whilemaintaining apparent even or balanced voltage supply between a sourceand an energy utilizing-load when placed into a circuit and energized.The various embodiments of the invention will also be able tosimultaneous and effectively provide energy conditioning functions thatinclude bypassing, decoupling, energy storage, while maintaining acontinued balance in SSO (Simultaneous Switching Operations) stateswithout contributing disruptive energy parasitics back into the circuitsystem as the invention is passively operated within the circuit.

BACKGROUND OF THE INVENTION

[0004] Interposer structures can be used in the manufacturing process ofsingle and multi-chip modules (SCMs or MCMs) to electrically connect oneor more integrated circuit chips (ICs) to a printed circuit board,discreet IC electronic packaging, or other substrates. The interposerprovides conditioning of various forms of energy propagating along thecontained internal interposer conductive pathways located between anenergy source and an energy-utilizing load such as an IC. The interposercan provide energy paths between the IC chips and a PC board orsubstrate, and if desired, between different active component chipsmounted on the interposer, itself.

[0005] A main disadvantage of conventional approaches to interconnectingand packaging of IC chips in Multi Chip Modules (MCMs) arises from thethinness of the substrates used in traditional multichip modules resultsin the energy feeds to the IC chips having relatively high impedance.This results in undesired noise, energy loss and excess thermal energyproduction. These problems are relevant and can be critical to systemintegrity when routing or propagating energy along pathways though aninterposer substrate.

[0006] Electrical systems have undergone short product life cycles overthe last decade. A system built just two years ago can be consideredobsolete to a third or fourth generation variation of the sameapplication. Accordingly, passive electronic components and thecircuitry built into these the systems need to evolve just as quickly.However, the evolvement of passive electronic componentry has not keptpace. The performance of a computer or other electronic systems hastypically been constrained by the operating frequency of its slowestactive elements. Until recently, those elements were the microprocessorand the memory components that controlled the overall system's specificfunctions and calculations. Nevertheless, with the advent of newgenerations of microprocessors, memory components and their data, thefocus has changed. There is intense pressure upon the industry toprovide the system user with increased processing energy and speed at adecreasing unit cost. EMI created in these environments must also beeliminated or minimized to meet international emission and/orsusceptibility requirements.

[0007] Processor operating frequency (speed) is now matched by thedevelopment and deployment of ultra-fast RAM (Random Access Memory)architectures. These breakthroughs have allowed an increase of theoverall system—operating frequency (speed) of the active components pastthe 1 GHz mark. During this same period, however, passive componenttechnologies have failed to keep up with these new breakthroughs andhave produced only incremental changes in composition and performance.These advances in passive component design and changes have focusedprimarily upon component size reduction, slight modifications ofdiscrete component electrode layering, dielectric discoveries, andmodifications of device manufacturing techniques or rates of productionthat decrease unit production cycle times.

[0008] In addition, at these higher frequencies, energy pathways shouldnormally be grouped or paired as an electrically complementary elementor elements that work together electrically and magnetically in harmonyand in balance within an energized system. Attempts to line conditionpropagating energy with prior art components has led to increased levelsof interference in the form of EMI, RFI, and capacitive and inductiveparasitics. These increases are due in part to manufacturing imbalancesand performance deficiencies of the passive components that create orinduce interference into the associated electrical circuitry.

[0009] These problems have created a new industry focus on passivecomponents whereas, only a few years ago, the focus was primarily on theinterference created by the active components from sources andconditions such as voltage imbalances located on both sides of a commonreference or ground path, spurious voltage transients from energy surgesor human beings, or other electromagnetic wave generators.

[0010] At higher operating speeds, EMI can also be generated from theelectrical circuit pathway itself, which makes shielding from EMIdesirable. Differential and common mode noise energy can be generatedand will traverse along and around cables, circuit board tracks ortraces, and along almost any high-speed transmission line or bus linepathway. In many cases, one or more of these critical energy conductorscan act as an antenna, hence creating energy fields that radiate fromthese conductors and aggravate the problem even more. Other sources ofEMI interference are generated from the active silicon components asthey operate or switch. These problems such as SSO are notorious causesof circuit disruptions. Other problems include unshielded and parasiticenergy that freely couples upon or onto the electrical circuitry andgenerates significant interference at high frequencies.

[0011] U.S. patent application Ser. No. 09/561,283 filed on Apr. 28,2000 and U.S. patent application Ser. No. 09/579,606 filed on May 26,2000, and U.S. patent application Ser. No. 09/594,447 filed on Jun. 15,2000 along with U.S. Provisional Application No. 60/200,327 filed Apr.28, 2000, U.S. Provisional Application No. 60/203,863 filed May 12,2000, and U.S. Provisional Application No. 60/215,314 filed Jun. 30,2000 by the applicants relate to continued improvements to a family ofdiscrete, multi-functional energy conditioners. These multi-functionalenergy conditioners posses a commonly shared, centrally located,conductive electrode of a structure that can simultaneously interactwith energized and paired conductive pathway electrodes contained inenergy-carrying conductive pathways. These energy-carrying conductivepathways can operate in an oppositely phased or charged manner withrespect to each other and are separated from one another by a physicalshielding.

SUMMARY OF THE INVENTION

[0012] Based upon the foregoing, there has been found a need to providea manufactured interposed circuit connection device that uses a layered,multi-functional, common conductive shield structure containingenergy-conductive pathways that share a common and centrally positionedconductive pathway or electrode as part of its structure which allowsfor energy conditioning as well as a multitude of other functionssimultaneously in one complete unit.

[0013] The invention will also comprise at least one inclusiveembodiment or embodiment variation that possesses a commonly shared andcentrally positioned conductive pathway or electrode as part of itsstructure.

[0014] The invention will also provide for simultaneous physical andelectrical shielding to portions of an active chip structure as well asfor internal propagating energies within the new structure by allowingpredetermined, simultaneous energy interactions to take place betweengrouped and energized conductive pathways to be fed by pathways externalto the embodiment elements.

[0015] This application expands upon this concept and further disclosesa new circuit interposer comprising a multilayer, universalmulti-functional, common conductive shield structure with conductivepathways that replaces multiple, discreet versions of various prior artdevices with a single individual unit that provides a cost effectivesystem of circuit protection and conditioning that will help solve orreduce industry problems and obstacles as described above.

[0016] Accordingly, the solution to low impedance energy distributionabove several hundred MHz lies in thin dielectric energy planetechnology, in accordance with the present invention, which is much moreeffective than multiple, discrete decoupling capacitors.

[0017] It is an object of the invention to be able to provide energydecoupling for active system loads while simultaneously maintaining aconstant, apparent voltage potential for that same portion of activecomponents and its circuitry.

[0018] It is an object of the invention to minimize or suppress unwantedelectromagnetic emissions resulting from differential and common modecurrents flowing within electronic pathways that come under theinvention influence.

[0019] It is an object of the invention to provide a wide variety ofmulti-layered embodiments and utilize a host of dielectric materials,unlimited by their specific physical properties that can, when attachedinto circuitry and energized, provide simultaneous line conditioningfunctions and protections as will be described.

[0020] It is an object of the invention to provide the ability to theuser to solve problems or limitations not met with prior art deviceswhich include, but are not limited to, simultaneous source to loadand/or load to source decoupling, differential mode and common mode EMIfiltering, containment and exclusion of certain energies such ascapacitive and inductive parasitics, as well as parasitic containmentand surge protection in one integrated embodiment and that performsthese described abilities when utilizing a conductive area or pathway.

[0021] It is an object of the invention to be easily adapted toutilization with or without, one or more external conductive attachmentsto a conductive area located external to the originally manufacturedinvention. The external connection to a conductive area—can aid theinvention embodiments in providing protection to electronic systemcircuitry.

[0022] It is an object of the invention to provide a physicallyintegrated, shield-containment, conductive electrode architecture forthe use with independent electrode materials and/or an independentdielectric material composition, that when manufactured, will not limitthe invention to a specific form, shape, or size for the multitude ofpossible embodiments of the invention that can be created and is notlimited to embodiments shown herein.

[0023] It is another object of the invention to provide a constantapparent voltage potential for portions of circuitry.

[0024] It is another object of the invention to provide an embodimentthat utilizes standard manufacturing processes and be constructed ofcommonly found dielectric and conductive materials or conductively madematerials to reach tight capacitive, inductive and resistive tolerancesbetween or along electrical pathways within the embodiment, whilesimultaneously maintaining a constant and uninterrupted conductivepathway for energy propagating from a source to an energy utilizingload.

[0025] It is another object of this invention to provide a means oflowering circuit impedance by providing and maintaining conductivepathways that are essentially in parallel within the interposer to theenergy source and the energy-utilizing load when attached into circuitrybetween these their energy conduits and to a circuit reference node orground as a low circuit impedance pathway.

[0026] Lastly, it is an object of the invention to provide an embodimentthat couples pairs or groups of paired electrical pathways or conductorsvery closely in relation to one another into an area or space partiallyenveloped by a plurality of commonly joined conductive electrodes,plates, or pathways, and can provide a user with a choice of selectivelycoupling external conductors or pathways on to separate or commonconductive pathways or electrode plates located within the sameembodiment.

[0027] Numerous other arrangements and configurations are also disclosedwhich implement and build upon the above objects and advantages of theinvention in order to demonstrate the versatility arid wide spreadapplication of a universal energy conditioning interposer with circuitarchitecture for energy and EMI conditioning and protection within thescope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028]FIG. 1A shows an exploded perspective view of an embodiment fromfamily multi-functional energy conditioners;

[0029]FIG. 1B shows an exploded perspective view of an alternateembodiment from the family multi-functional energy conditioners shown inFIG. 1A;

[0030]FIG. 2 provides a circuit schematic representation of the physicalarchitecture from FIG. 1A and FIG. 1B when placed into a largerelectrical system and energized;

[0031]FIG. 3 shows a top view of a portion of some of the non-holedembodiment elements comprising a portion of a Faraday cage-likeconductive shield structure and a by-pass conductive pathway electrode;

[0032]FIG. 4 shows an exploded perspective view of a portion thenon-holed embodiment elements that form a Faraday cage-like conductiveshield structure that comprises a non-holed, interconnected, parallel,common conductive shield structure;

[0033]FIG. 5A shows an exploded cross-section view of a non-holed,multi-layered by-pass arrangement of the circuit architecture used inpresent invention configurations with outer image shields;

[0034]FIG. 5B shows a second exploded cross-sectional view of a layeredby-pass as shown in FIG. 5A and rotated 90 degrees there from;

[0035]FIG. 6A shows an exploded view of a layered arrangement of anembodiment of the present invention with outer image shields;

[0036]FIG. 6B shows a partial view of the interposer arrangementdepicted in FIG. 6A mounted above an Integrated Circuit Die placed intoa portion of an Integrated Circuit Package that uses wireleads or pininterconnection instead of ball grid interconnections;

[0037]FIG. 7 shows a top view of an interposer arrangement;

[0038]FIG. 8A shows a cross-sectional view of an alternate interposerarrangement depicted in FIG. 7;

[0039]FIG. 8B shows a partial cross-sectional view of the interposerarrangement depicted in FIG. 7 now mounted in between an IntegratedCircuit Die Integrated Circuit Package with ball grid interconnection isshown;

[0040]FIG. 9 shows a close-up view of a solder ball interconnection ofFIG. 8A;

[0041]FIG. 10 shows a partial top external view of an Integrated CircuitPackage showing the outline of a prior art interposer with externallymounted, discrete arrays used to assist energy conditioning;

[0042]FIG. 11 shows a partial top external view of an Integrated CircuitPackage similarly depicted in FIG. 10 but with out the prior artinterposer but the new invention placed between an Integrated CircuitDie Integrated Circuit Package with ball grid interconnection is shown;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0043] As used herein, the acronym terms “UECICA” will be used to mean auniversal energy conditioning interposer with circuit architecture forenergy and EMI conditioning and protection within the scope of thepresent invention and refers to all types of discrete versions of thedevice.

[0044] In addition, as used herein, the acronym term “AOC” for the words“predetermined area or space of physical convergence or junction” whichis defined as the physical boundary of manufactured-together inventionelements. Non-energization and energization are defined as the range ordegree to which electrons within the “AOC” of either discrete ornon-discrete versions of UECICA are in motion and are propagating toand/or from an area located outside the pre-determined in a balancedmanner.

[0045] U.S. Pat. No. 6,018,448, which is a continuation-in-part ofapplication Ser. No. 09/008,769 filed Jan. 19, 1998, now issued as U.S.Pat. No. 6,097,581, which is a continuation-in-part of applicationSerial No. 08/841,940 filed Apr. 8, 1997, now issued as U.S. Pat. No.5,909,350 and US Patent U.S. patent application Ser. No. 09/561,283filed on Apr. 28, 2000, U.S. patent application Ser. No. 09/579,606filed on May 26, 2000, and U.S. patent application Ser. No. 09/594,447filed on Jun. 15, 2000 along with U.S. Provisional Application No.60/215,314 filed Jun. 30, 2000 by the applicants relate to continuedimprovements to a family of discrete, multi-functional energyconditioners and multi-functional energy conditioning shield structuresand are incorporated by reference, herein.

[0046] The new UECICA begins as a combination of electricallyconductive, electrically semi-conductive, and non-conductive dielectricindependent materials, layered or stacked in various structures. Theselayers can be combined to form a unique circuit when placed andenergized in a system. The invention embodiments can include layers ofelectrically conductive, electrically semi-conductive, andnon-conductive materials that form groups of common conductive pathwayelectrodes, differentially phased conductors, deposits, plates, VIAs,filled and unfilled conductive apertures that can all be referred to atone time or another, herein as meaning ‘energy conductive pathway’.Herein, the term “common conductive”, means the same species of energypathway that may all be joined together in one conductive structure as acommon energy pathway of low impedance as opposed to a differentialconductive pathway that is usually written as with respect to anotherpathway that is paired up with the same in an energized circuit thatwould have an electrically opposite pathway functioningelectromagnetically, in most cases, 180 degrees opposite our out ofphase with its counterpart.

[0047] Dielectric, non-conductive and semi-conductive mediums ormaterials can also be referred to as simply insulators, non-pathways orsimply dielectric. Some of these elements are oriented in a generallyparallel relationship with respect to one another and to a predeterminedpairing or groups of similar elements that can also include variouscombinations of conductive pathways and their layering made into apredetermined or manufactured structure. Other elements of the inventioncan be oriented in a generally parallel relationship with respect to oneanother and yet will be in a generally perpendicular relationship withother elements of the same invention.

[0048] Predetermined arrangements are used in manufacturing theinvention to combine many of the elements just described such asdielectric layers, multiple electrode conductive pathways, sheets,laminates, deposits, multiple common conductive pathways, shields,sheets, laminates, or deposits, together in an interweaved arrangementof overlapping, partially overlapping and non-overlapping positions withrespect to other physical structures with in the invention made upidentically of the same materials yet are effected by a predeterminedconfiguration sequence of the end manufactured result that connectsspecific types of these same elements such as VIAs, dielectric layers,multiple electrode conductive pathways, sheets, laminates, deposits,multiple common conductive pathways, shields, sheets, laminates, ordeposits, together for final energizing into a larger electrical systemin a predetermined manner.

[0049] Other conductive energy pathways can intersect and pass throughthe various layers just described and can be in a generally non-parallelor even perpendicular relationship with respect to these same groups oflayers. Conductive and nonconductive spacers can be attached to thevarious groups of layers and intersecting, perpendicular pathways in apredetermined manner that allows various degrees and functions of energyconditioning to occur with portions of propagating energy passing intoand out of the invention AOC.

[0050] As for all embodiments of the present invention depicted andthose not pictured, the applicants contemplate a manufacturer to havethe option in some cases, for combining a variety and wide range ofpossible materials that are selected and combined into the final make-upof the invention while still maintaining some or nearly all of thedesired degrees of electrical conditioning functions of the inventionafter it is manufactured and placed into a circuit and energized.Materials for composition of the invention can comprise one or morelayers of material elements compatible with available processingtechnology and is not limited to any possible dielectric material. Thesematerials may be a semiconductor material such as silicon, germanium,gallium-arsenide, or a semi-insulating or insulating material and thelike such as, but not limited to any material having a specificdielectric constant, K.

[0051] Equally so, the invention is not limited: to any possibleconductive material such as magnetic, nickel-based materials, MOV-typematerial, ferrite material;—any substances and processes that can createconductive pathways for a conductive material such as Mylar films orprinted circuit board materials; or any substances or processes that cancreate conductive areas such as, but not limited to, doped polysilicons,sintered polycrystallines, metals, or polysilicon silicates, polysiliconsilicide. When or after the structured layer arrangement is manufacturedas an interposer it is not limited to just IC packages, it can becombined with, shaped, buried within or embedded, enveloped, or insertedinto various electrical packaging, other substrates, boards, electricalarrangements, electrical systems or other electrical sub-systems toperform simultaneous energy conditioning, decoupling, so to aid inmodifying an electrical transmission of energy into a desired electricalform or electrical shape.

[0052] An alternative embodiment can serve as a possible system orsubsystem electrical platform that contains both active and passivecomponents along with additional circuitry, layered to provide most ofthe benefits described for conditioning propagated energy from a sourceto a load and back to a return. Some prior art interposers are alreadyutilizing predetermined layered configurations with VIAs to service ortap the various conductive pathways or layers that lie between adielectric or an insulating material.

[0053] The invention will also comprise at least one inclusiveembodiment or embodiment variation that possesses a commonly shared andcentrally positioned conductive pathway or electrode as part of itsstructure.

[0054] The invention will also provide for simultaneous physical andelectrical shielding to portions an active chip structure as well as forinternally propagating energies within the new structure by allowingpredetermined, simultaneous energy interactions to take place betweengrouped and energized—conductive pathways to be fed by pathways externalto the embodiment elements.

[0055] Existing prior art discrete decoupling capacitors lose theireffectiveness at about 500 MHz. For example, mounting inductance for0603 size capacitors has been reduced to approximately 300 pH. Assuming200 pH for the internal capacitance of the capacitors, this equates to atotal of 500 pH, which corresponds to 1.57-Ohms at 500 MHz. Accordingly,current discrete capacitors are not effective. While it is possible touse multiple components that have various values of series resonantfrequencies and low ESR capacitors to drive towards low impedance at 500MHz, the capacitance required to obtain 500 MHz with 500 pH ESL is about200 pF. Current board materials (FR-4, 4 mils dielectric)—get 225 pF forevery square inch of energy planes, which would require more than onediscrete capacitor every square inch. Normally, various interposers thatcontain multiple discrete passive component structures offer into thecircuitry a lack of electrical balance that in turn creates additionaldiscontinuities with their presence in the energized circuit system.

[0056] A superior approach when utilizing various interconnectionplatforms and methodologies for direct IC chip attachment configurationsto a PCB or other package connections is to provide low impedance fromthe energy pathways or electrode planes using a single embodiment. It isimpractical to utilize many discrete, low impedancede-couplingcapacitors on an interposer or PCB, if low impedance energy planes arenot available to hook them up.

[0057] This application expands upon this concept and further disclosesa new circuit interposer comprising a multi-layer, universalmulti-functional, common conductive shield structure with conductivepathways that replaces multiple, discreet versions of various prior artcomponents with a single individual unit that provides a cost effective,single component embodiment variations of what the applicants believe tobe a new universal system of circuit protection and conditioning thatwill help solve or reduce industry problems and obstacles as describedabove with simplicity and an exponential effectiveness.

[0058] Accordingly, the solution to low impedance energy distributionabove several hundred MHz lies in thin dielectric energy planetechnology, in accordance with the present invention, which is much moreeffective than multiple, discrete decoupling capacitors.

[0059] Therefore, it is also an object of the invention to be able tooperate effectively across a broad frequency range as compared to asingle discrete capacitor component or a multiple passive conditioningnetwork while maintaining a complete energy delivery protocol to asingle or multiple units of active components utilizing portions ofpropagating energy within a circuit. Ideally, this invention can beuniversal in its application potentials, and by utilizing variousembodiments of predetermined grouped elements, a working invention willcontinue to perform effectively within a system operating beyond 1 GHzof frequency.

[0060] To propagate electromagnetic interference energy, two fields arerequired, an electric field and a magnetic field. Electric fields coupleenergy into circuits through the voltage differential between two ormore points. Changing electrical fields in a space give rise to amagnetic field. Any time-varying magnetic flux will give rise to anelectric field. As a result, a purely electric or purely magnetictime-varying field cannot exist independent of each other. Maxwell'sfirst equation is known as the divergence theorem based on Gauss's law.This equation applies to the accumulation of an electric charge thatcreates an electrostatic field, (“E-Field”) and is best observed betweentwo boundaries, conductive and nonconductive. This boundary conditionbehavior referenced in Gauss's law causes a conductive enclosure (alsocalled a Faraday cage) to act as an electrostatic shield.

[0061] At a pre-determined boundary or edge, electric charges can bekept on the inside of the internally located conductive boundary of apathway of the invention as a result of pre-determined design actionstaken when the invention was built, specific manufacturing methodologiesand techniques described herein account for the end product performancewhen placed into a circuit and energized.

[0062] Electric charges that exist outside a pre-determined boundary oredge of the internal conductive boundary of a pathway inside theinvention are also excluded from effecting the very same internallygenerated fields trying to leave the same conductive pathways.

[0063] Maxwell's second equation illustrates that there are no magneticcharges (no monopoles), only electric charges. Electric charges areeither positively charged or negatively charged. Magnetic fields areproduced through the action of electric currents and fields. Electriccurrents and fields (“E-Field”) emanate as a point source. Magneticfields form closed loops around the current that generates fieldslocated on along the energized conductive pathways. Maxwell's thirdequation, also called Faraday's Law of Induction, describes a magneticfield (H-Field) traveling in a closed loop circuit, generating current.The third equation describes the creation of electric fields fromchanging magnetic fields. Magnetic fields are commonly found intransformers or windings, such as electric motors, generators, and thelike. Together Maxwell's third & fourth equations describe how coupledelectric and magnetic fields propagate (radiate) at the speed of light.This equation also describes the concept of “skin effect,” whichpredicts the effectiveness of magnetic shielding and can even predictthe effectiveness of non-magnetic shielding.

[0064] There are two kinds of grounds normally found in today'selectronics: earth-ground and circuit ground. The earth is not anequipotential surface, so earth ground potential can vary. Additionally,the earth has other electrical properties that are not conducive to itsuse as a return conductor in a circuit. However, circuits are oftenconnected to earth ground for protection against shock hazards. Theother kind of ground or common conductive pathway, circuit commonconductive pathway, is an arbitrarily selected reference node in acircuit-the node with respect to which other node voltages in thecircuit are measured. All common conductive pathway points in thecircuit do not have to go to an external grounded trace on a PCB,Carrier or IC Package, but can be taken directly to the internal commonconductive pathways. This leaves each current loop in the circuit freeto complete itself in whatever configuration yields minimum path ofleast impedance for portions of energy effected in the AOC of the newinvention. It can work for frequencies wherein the path of leastimpedance is primarily inductive.

[0065] With respect to grounding as just described above, there are atleast three shielding functions that occur within the invention. First,a physical shielding of differential conductive pathways accomplished bythe size of the common conductive pathways in relationship to the sizeof the differentially conductive pathways and by the energized,electrostatic suppression or minimization of parasitics originating fromthe sandwiched differential conductors as well as preventing externalparasitics not original to the contained differential pathways fromconversely attempting to couple on to the shielded differentialpathways, sometimes referred to among others as capacitive coupling.Capacitive coupling is known as electric field (“E”) coupling and thisshielding function amounts to primarily shielding electrostaticallyagainst electric field parasitics. Capacitive coupling involving thepassage of interfering propagating energies because of mutual or straycapacitances that originate from the differential conductor pathways issuppressed within the new invention. The invention blocks capacitivecoupling by almost completely enveloping the oppositely phasedconductors within Faraday cage-like conductive shield structures(‘FCLS’) that provide an electrostatic or Faraday shield effect and withthe positioning of the layering and pre-determined layering positionboth vertically and horizontally (inter-mingling).

[0066] In other prior art devices, if shield coverage is not 100%, theshield structure is usually grounded to ensure that circuit-to-shieldcapacitances go to propagating energy reference common conductivepathway rather than act as feedback and cross-talk elements. However,the present invention can use an internal propagating energy referencecommon conductive pathway or an image ground within the device for this.The device's FCLS are used to suppress and prevent internal and external(with respect to the AOC) capacitive coupling between a potentiallynoisy conductor and a victim conductor, by an imposition of commonconductive pathway layers positioned between each differentialconductive pathway conductors any stray capacitance.

[0067] Secondly, a conductor positioning shielding technique which isused against inductive energy coupling and is also known as mutualinductive cancellation or minimization of portions of energy propagatingalong separate and opposing conductive pathways.

[0068] Finally, a physical shielding function for RF noise. Inductivecoupling is magnetic field (“H”) coupling, so this shielding functionamounts to shielding against magnetic shields and this shielding occurswith in the device through mutual cancellation or minimization. RFshielding is the classical “metallic barrier” against all sorts ofelectromagnetic fields and is what most people believe shielding isabout. There are two aspects to defending a circuit against inductivepickup. One aspect is to try to minimize the offensive fields at theirsource This is done by minimizing the area of the current loop at thesource so as to promote field cancellation or minimization, as describedin the section on current loops. The other aspect is to minimize theinductive pickup in the victim circuit by minimizing the area of thatcurrent loop, since, from Lenz's law; the induced voltage isproportional to this area. So the two aspects really involve the samecooperative action: minimize the areas of the current loops. In otherwords, minimizing the offensiveness of a circuit inherently minimizesits susceptibility. Shielding against inductive coupling means nothingmore than controlling the dimensions of the current loops in thecircuit. The RF current in the circuit directly relates to signal andenergy distribution networks along with bypassing and decoupling.

[0069] RF currents are ultimately generated as harmonics of clock andother digital signals. Signal and propagating energy distributionnetworks must be as small as possible to minimize the loop area for theRF return currents. Bypassing and decoupling relate to the current drawthat must occur through a propagating energy distribution network, whichhas by definition, a large loop area for RF return currents. Inaddition, it also relates to the loop areas that must be reduced,electric fields that are created by improperly contained transmissionlines and excessive drive voltage.

[0070] The best way to minimize loop areas when many current loops areinvolved is to use a common conductive pathway. The idea behind RFshielding is that time-varying EMI fields induce currents in theshielding material. The freedom to use any material and dielectric inthe construction of the assembly allows this constraint to be overcome.More formally, losses commonly referred to an absorption loss,re-radiation losses, or reflection loss, can be more controlled.

[0071] A common conductive pathway is a conducting surface that is toserve as a return conductor for all the current loops in the circuit.The invention uses its common conductive shields as an separate internalcommon conductive pathway located between but sandwiching thenon-aperture using conductors to provide a physically tight or minimizedenergy loop between the interposer and the active chip that the energyis being condition for. A hole-thru, common conductivepathway-possessing structure works as well as a non-hole element of theassembly as far as for minimizing loop area is concerned. The key toattaining minimum loop areas for all the current loops together is tolet the common conductive pathway currents distribute themselves aroundthe entire area of the component's common conductive pathway areaelements as freely as possible.

[0072] By surrounding predetermined conductive pathway electrodes withcage-like structures made up with one centralized and shared, commonconductive pathway or area, this common pathway or area becomes a0-reference common conductive pathway for circuit voltages and existsbetween at least two oppositely phased or voltage potential conductivestructures which in turn are located each respectively on opposite sidesof the just described sandwiched centralized and shared, commonconductive pathway or area.

[0073] The addition of two additional common conductive pathways can beadded to the previously disclosed five common conductive pathways intoan electrically common structure that now almost completely envelopesthe two differentially energized pathways as just described is a type ofconfiguration that significantly completes the energized functions ofsuppressing or minimizing E-Fields and H-fields, stray capacitances,stray inductances, parasitics, and allowing for mutual cancellation orminimization of oppositely charged or phased, adjoining or abutting,electrical fields of the variously positioned propagating energypathways. In the last step for the horizontal layering process of a7-layer interposer, two additional common pathways sandwich the first5-layers as previously described. A SCM or MCM, for example, built withthe invention can take advantage of the various third conductivepathways common to one another or to the grounding, schemes used now bylarge SCM and MCM manufacturers.

[0074] In the invention, the feed path for portions of propagatingenergy and the return path for similar portions of propagating energywith in the invention are separated by microns of distance and normallyby only by a common conductive pathway and some predetermineddielectric. Such a configuration allows for suppression or minimizationand minimizes or cancels the portions of circuit energy that exists inthe magnetic field and that is produced by this very tiny current loop.Maintaining a very effective mutual cancellation or minimization ofinductance of opposing but shielded differential conductive pathwayswill effect the minimal magnetic flux remaining and means minimalsusceptibility to inductive coupling, anywhere internally of theinventions elements.

[0075] The new invention mimics the functionality of anelectrostatically shielded, transformer. Transformers are also widelyused to provide common mode (CM) isolation. These devices depend on adifferential mode transfer (DM) across their input to magnetically linkthe primary windings to the secondary windings in their attempt totransfer energy. As a result, CM voltage across the primary winding isrejected. One flaw that is inherent in the manufacturing of transformersis propagating energy source capacitance between the primary andsecondary windings. As the frequency of the circuit increases, so doescapacitive coupling; circuit isolation is now compromised. If enoughparasitic capacitance exists, high frequency RF energy (fast transients,ESD, lighting, etc.) may pass through the transformer and cause an upsetin the circuits on the other side of the isolation gap that receivedthis transient event. Depending on the type and application of thetransformer, a shield may be provided between the primary and secondarywindings. This shield, connected to a common conductive pathwayreference source, is designed to prevent against capacitive couplingbetween the two sets of windings.

[0076] The new invention also resembles in energy transfer or energypropagation the workings of a transformer and the new device effectivelyuses not just a physical shield to suppress parasitics and such, it alsouses positioning of it's layering, connections of the layering, and theexternal combination with an external circuitry, to effectively functionin a novel and unexpected way.

[0077] If a system is being upset by AC line transients, this type offunction will provide the fix. In prior art devices, to be effective inthis type of application; a shield must be connected to an externalcommon conductive pathway. However, the new invention provides analternative to this axiom.

[0078] A passive architecture, such as utilized by the invention, can bebuilt to condition or minimize both types of energy fields that can befound in an electrical system. While the invention is not necessarilybuilt to condition one type of field more than another, however, it iscontemplated that different types of materials can be added or used tobuild an embodiment that could do such specific conditioning upon oneenergy field over another. In the invention, laying horizontal perimeterconnections on the sides of the passive component element of theassembly or placement of vertical apertures through passive element,selectively coupling or not coupling these VIAS and/or conductivelyfilled apertures, allows the passage of propagating energy transmissionsto occur as if they were going a feed-through-like filtering device.

[0079] When prior art interposers are placed into a circuit andenergized, their manufacturing tolerances of the devices are carried tothe circuit and revealed at circuit energization. These imbalancevariables are multiplied with the addition of multiple pathways andcause voltage imbalances in the circuit.

[0080] Use of the invention will allow placement into a differentiallyoperated circuitry and will provide a virtually electrically balancedand essentially, equal capacitance, inductive and resistance tolerancesof one invention unit, that is shared and located between each pairedenergy pathway within the device, equally, and in a balanced electricalmanner. Invention manufacturing tolerances or pathway balances between acommonly shared central conductive pathway found internally within theinvention is maintained at levels that originated at the factory duringmanufacturing of the invention, even with the use of commonnon-conductive materials, dielectrics or conductive materials, which arewidely and commonly specified among discrete units. Thus, an inventionthat is manufactured at 5% tolerance, when manufactured as described inthe disclosure will also have a correlated 5% electrical tolerancebetween single or multiple, paired energy pathways in the invention whenplaced into an energized system. This means that the invention allowsthe use of relatively inexpensive materials, due to the nature of thearchitecture's minimal structure such that variation is reduced and theproper balance between energized paired pathways or differential energypathways is obtained.

[0081] Expensive, non-commonly used, specialized, dielectric materialsare no longer needed for many delicate bypass and/or energy decouplingoperations in an attempt to maintain a energy conditioning balancebetween two system conductive pathways, as well as giving an inventionusers the opportunity to use a single balanced element that ishomogeneous in material make up within the entire circuit. The newinvention can be placed between paired or a paired plurality of energypathways or differential conductive pathways in the invention, while thecommon conductive pathways that also make up the invention can beconnected to a third conductive pathway or pathways that are common toall elements of the common conductive pathways internal in the inventionand common to an external conductive area, if desired.

[0082] The invention will simultaneous provide energy conditioningfunctions that include bypassing, energy, energy line decoupling, energystorage such that the differential electrodes are enveloped within theembodiment shield structure and are free from almost all internallygenerated capacitive or energy parasitics trying to escape from theenveloped containment area surrounding each of the conductive pathwayelectrodes. At the same time, the shield structure will act to preventany externally generated energy parasitics such as “floatingcapacitance” for example from coupling onto the very same differentialconductive pathways due to the physical shielding and the separation ofthe electrostatic shield effect created by the energization of thecommon conductive structure and its attachment with common means know tothe art to an internally or externally located conductive area orpathway.

[0083] Attachment to an external conductive area includes an industryattachment methodology that includes industry accepted materials andprocesses used to accomplish connections that can be applied in mostcases openly without additional constraints imposed when using adifferent device architecture. Through other functions such ascancellation or minimization of mutually opposing conductors, theinvention allows a low impedance pathway to develop within a Faradaycage-like unit with respect to the enveloping conductive common shieldspathways that can subsequently continue to move energy out onto anexternally located conductive area that can include, but is not limitedto, a “floating’, non-potential conductive area, circuit or systemground, circuit system return, chassis or PCB ground, or even an earthground.

[0084] The various attachment schemes described herein will normallyallow a “0” voltage reference to develop with respect to each pair orplurality of paired differential conductors located on opposite sides ofthe shared central and common conductive pathway, and be equal yetopposite for each unit of a separated paired energy pathway orstructure, between the centrally positioned interposing, commonconductive shield pathway used. Use of the invention allows voltage tobe maintained and balanced even with multiple SSO (SimultaneousSwitching Operations) states among transistor gates located within anactive integrated circuit all without contributing disruptive energyparasitics back into the energized system as the invention is passivelyoperated, within its attached circuit.

[0085] Thus, parasitics of all types are minimized from upsetting thecapacitance, inductive and resistance tolerances or balance that weremanufactured into the unenergized invention. The prior art has normallyallowed effects from free parasitics in both directions to disrupt acircuit despite the best attempts to the contrary with all prior artdevices to date.

[0086] As previously noted, propagated electromagnetic interference canbe the product of both electric and magnetic fields. Until recently,emphasis in the art has been placed upon on filtering EMI from circuitor energy conductors carrying high frequency noise with DC energy orcurrent. However, the invention is capable of conditioning energy thatuses DC, AC, and AC/DC hybrid-type propagation of energy alongconductive pathways found in an electrical system or test equipment.This includes use of the invention to condition energy in systems thatcontain many different types of energy propagation formats, in systemsthat contain many kinds of circuitry propagation characteristics, withinthe same electrical system platform.

[0087] Principals of a Faraday cage-like conductive shield like are usedwhen the common conductive pathways are joined to one another and thegrouping of these conductive pathways, together co-act with the larger,external conductive pathway, pathway area or surface that provides agreater conductive surface area in which to dissipate over voltages andsurges and initiate Faraday cage-like conductive shield structureelectrostatic functions of suppression or minimization of parasitics andother transients, simultaneously. When a plurality of common conductivepathways as just described are electrically coupled as either a system,circuit reference node, or chassis ground, they can be relied upon as acommonly used, reference common conductive pathway for a circuit inwhich the invention is placed into and energized.

[0088] One or more of a plurality of conductive or dielectric materialshaving different electrical characteristics from one another can beinserted and maintained between common conductive pathways anddifferential electrode pathways. Although a specific differentialpathway can be comprised of a plurality of commonly conductivestructures, they are performing differentially phased conditioning withrespect to a “mate” or paired plurality of oppositely phased or chargedstructures that form half of the total sum of all of the manufactureddifferential conductive pathways contained with in the structure. Thetotal sum of the differential pathways will also will normally beseparated electrically in an even manner with equal number of pathwaysused simultaneously but with half the total sum of the individualdifferential conductive pathways approximately 180 degrees out of phasefrom the oppositely positioned groupings. Microns of dielectric andconductive material normally includes a predetermined type of dielectricalong with a interposing and shield functioning common conductivepathway, which in almost all cases and do not physically couple to anyof the differentially operating conductive pathways within theinvention, itself or its AOC.

[0089] In contrast to the prior art, the new invention to provides ameans of lowering circuit impedance facilitated by providing interactionof mutually opposing conductive pathways that are maintained in what isessentially, a parallel relationship, respectively within the interposerand with respect to the circuit energy source and the circuit'senergy-utilizing load when attached and energized into circuitry betweenthese their energy conduits and to a circuit reference node or commonconductive pathway used as a low circuit impedance pathway by portionsof propagating energy. At the same time, a entirely different group ofmutually opposing conductive pathway elements can be maintained in whatis essentially, a parallel relationship respectively to one another andyet be physically perpendicular to the first set of parallel mutuallyopposing conductive pathway elements simultaneously working inconjunction with the second set just described.

[0090] The user has options of connection to an external GnD area, analternative common conductive return path, or simply to an internalcircuit or system circuit common conductive pathway or common conductivenode. In some applications, it might be desired by the user toexternally attach to additional numbers of paired external conductivepathways not of the original differential conductive pathways to takeadvantage of the lowering of circuit impedance occurring within theinvention. This low impedance path phenomenon can occur by usingalternative or auxiliary circuit return pathways, as well. In this case,at energization, the various internal and simultaneous functionsoccurring to create a low impedance conductive pathway along the commonconductive pathways internal to the new inventive structure is used byportions of energy propagating along the differential conductivepathways in essentially a parallel manner and within the interposer asit normally operates in a position, physically placed in between thevarious conductive pathways, running from energy source and theenergy-utilizing load and back as attached into an energized circuit.Differential conductive energy pathways will be able utilize a circuit“0” Voltage reference image node or “0” Voltage common conductivepathway node created along the internal common conductive pathway inconjunction with the common conductive energy pathway shields thatsurround the differential conductive pathways almost completely, andcoact as a joined together common conductive structure to facilitateenergy propagation along the low impedance pathway, not of thedifferential pathways and allowing unwanted EMI or noise to move to thiscreated pathway at energization and passive operations rather thandetrimentally effecting the very circuit and portions of energy that arebeing conditioned in the AOC of the new interposer.

[0091] The attached plurality of internal common conductive electrodepathways that make up a Faraday cage-like conductive shield structure aspart of the whole interposer invention will allow the external commonconductive area or return pathway to become, in essence, an extendedversion of itself, internally and closely positioned in an essentiallyparallel arrangement only microns of distance from differentiallyoperating conductive pathways that are them selves extensions of theexternal differential conductive elements with respect to their positionlocated apart and on either side of at least one common conductivepathway that is taking on multiple shielding functions simultaneouslyduring energization. This phenomena occurs internally in otherembodiments such as, but not limited to, printed circuit boards (PCB),daughter cards, memory modules, test connectors, connectors, interposersfor Single Chip Modules or Multi-Chip Modules (SCM or MCM) or otherintegrated circuit packages utilizing interposer interconnection atsubsequent energization.

[0092] Additional objects and advantages of the invention will becomeapparent to those skilled in the art upon reference to the detaileddescription taken in conjunction with the provided figures.

[0093] Turning now to FIG. 1, an exploded perspective view ofmulti-functional energy conditioner 10's physical architecture is shown.Multi-functional energy conditioner 10 is comprised of a plurality ofcommon conductive pathways 14 at least two electrode pathways 16A and16B where each electrode pathway 16 is sandwiched between two commonconductive pathways 14. At least one pair of electrical conductors 12Aand 12B is disposed through insulating apertures 18 or couplingapertures 20 of the plurality of common conductive pathways 14 andelectrode pathways 16A and 16B with electrical conductors 12A and 12Balso being selectively connected to coupling apertures 20 of electrodepathways 16A and 16B. Common conductive pathways 14 comprise of aconductive material such as metal in a different embodiment, or in thepreferred embodiment, they can have conductive material deposited onto adielectric material or laminate (not shown) similar to processes used tomanufacture conventional multi-layered chip capacitors or multi-layeredchip energy conditioning elements and the like. At least one pair ofinsulating apertures 18 are disposed through each common conductivepathway electrode 14 to allow electrical conductors 12 to pass throughwhile maintaining electrical isolation between common conductivepathways 14 and electrical conductors 12. The plurality of commonconductive pathways 14 may optionally be equipped with fasteningapertures 22 arranged in a predetermined and matching position to enableeach of the plurality of common conductive pathways 14 to be coupledsecurely to one another through standard fastening means such as screwsand bolts or in alternative embodiments (not shown) by means that allowthe device to be manufactured and joined into a standardmonolithic-like, multilayer embodiments similar to the processes used inthe industry to manufacture prior art chip energy conditioning elementsand the like. Fastening apertures 22 or even a solder attachment ofcommon industry means and materials that can subsequently placeconductive termination bands (not shown) may also be used to securemulti-functional energy conditioner 10 to another non-conductive orcommon conductive surface such as an enclosure or chassis of theelectronic system or device the multi-functional energy conditioner 10is being used in conjunction with.

[0094] Electrode pathways 16A and 16B are similar to common conductivepathways 14 in that they are comprised of a conductive material or in adifferent embodiment, can have conductive material deposited onto adielectric laminate (not shown) or similar, that would allow the newembodiment to be manufactured and joined into a standardmonolithic-like, multilayer embodiments similar to the processes used inthe industry to manufacture prior art chip energy conditioning elementsand the like and have electrical conductors 12A and 12B disposed throughrespective apertures. Unlike joined, common conductive pathways 14,electrode pathways 16A and 16B are selectively electrically connected toone of the two electrical conductors 12. While electrode pathways 16, asshown in FIG. 1, are depicted as smaller than common conductive pathways14 this is not required but in this configuration has been done toprevent electrode pathways 16 from interfering with the physicalcoupling means of fastening apertures 22 or other bonding methods (notshown) and should be ideally inset within the common conductive pathways14 and thus they posses a smaller conductive area than common conductivepathways 14.

[0095] Electrical conductors 12 provide a current path that flows in thedirection indicated by the arrows positioned at either end of theelectrical conductors 12 as shown in FIG. 1. Electrical conductor 12Arepresents an electrical propagating conveyance path and electricalconductor 12B represents the propagating energy return path. While onlyone pair of electrical conductors 12A and 12B is shown, Applicantcontemplates multi-functional energy conditioner 10 being configured toprovide filtering with a plurality of pairs of electrical conductorslike 12A and 12B, as well as, electrode pathways 16A and 16B and commonconductive pathways 14 which are joined together for creating ahigh-density multi-conductor multi-functional energy conditioner.

[0096] Another element which makes up multi-functional energyconditioner 10 is material 28 which has one or a number of electricalproperties and surrounds the center common conductive pathway electrode14, both electrode pathways 16A and 16B and the portions of electricalconductors 12A and 12B passing between the two outer common conductivepathways 14 in a manner which isolates the pathways and conductors fromone another except for the connection created by the conductors 12A and12B and coupling aperture 20. The electrical characteristics ofmulti-functional energy conditioner 10 are determined by the selectionof material 28. If an X7R dielectric material is chosen, for example,multi-functional, energy conditioner 10 will have primarily capacitivecharacteristics. Material 28 may also be a metal oxide varistor materialthat will provide capacitive and surge protection characteristics. Othermaterials such as ferrites and sintered polycrystalline may be usedwherein ferrite materials provide an inherent inductance along withsurge protection characteristics in addition to the improved common modenoise cancellation or minimization that results from the mutual couplingcancellation or minimization effect. The sintered polycrystallinematerial provides conductive, dielectric, and magnetic properties.Sintered polycrystalline is described in detail in U.S. Pat. No.5,500,629, which is herein incorporated by reference.

[0097] Still referring to FIG. 1, the physical relationship of commonconductive pathways 14, electrode pathways 16A and 16B, electricalconductors 12A and 12B and material 28 will now be described in moredetail. The starting point is center common conductive pathway electrode14. Center pathway 14 has the pair of electrical conductors 12 disposedthrough their respective insulating apertures 18 which maintainelectrical isolation between common conductive pathway electrode 14 andboth electrical conductors 12A and 12B. On either side, both above andbelow, of center common conductive pathway electrode 14 are electrodepathways 16A and 16B each having the pair of electrical conductors 12Aand 12B disposed there through. Unlike center common conductive pathwayelectrode 14, only one electrical conductor, 12A or 12B, is isolatedfrom each electrode pathway, 16A or 16B, by an insulating aperture 18.One of the pair of electrical conductors, 12A or 12B, is electricallycoupled to the associated electrode pathway 16A or 16B respectivelythrough coupling aperture 20. Coupling aperture 20 interfaces with oneof the pair of electrical conductors 12 through a standard connectionsuch as a solder weld, a resistive fit or any other standardinterconnect methodology to provide a solid and secure physical andelectrical connection of predetermined conductive pathways. Formulti-functional energy conditioner 10 to function properly, upperelectrode pathway 16A must be electrically coupled to the oppositeelectrical conductor 12A than that to which lower electrode pathway 16Bis electrically coupled, that being electrical conductor 12B.Multi-functional energy conditioner 10 optionally comprises a pluralityof outer common conductive pathways 14.

[0098] These outer common conductive pathways 14 provide a significantlylarger conductive common conductive pathway and/or image plane when theplurality of common conductive pathways 14 are electrically connected toan outer edge conductive band 14A by conductive termination material orattached directly by tension seating means or commonly used solder-likematerials to an larger external conductive surface. 14A and 14B (notshown) that are physically separate of the differentially conductivepathways 16A and 16B and/or any plurality of electrical conductors suchas 12A and 12B for example. Connection to an external conductive areahelps with attenuation of radiated electromagnetic emissions andprovides a greater surface area in which to dissipate over voltages andsurges. Connection to an external conductive area helps electrostaticsuppression or minimization of any inductive or parasitic strays thatcan radiate or be absorbed by differentially conductive pathways 16A and16B and/or any plurality of differential electrical conductors such as12A and 12B for example.

[0099] Principals of a Faraday cage-like conductive shield structure areused when the common pathways are joined to one another as describedabove and the grouping of common conductive pathways together coact withthe larger external conductive area or surface to suppress radiatedelectromagnetic emissions and provide a greater conductive surface areain which to dissipate over voltages and surges and initiate Faradaycage-like conductive shield structure electrostatic functions ofsuppression or minimization of parasitics and other transients,simultaneously. This is particularly true when plurality of commonconductive pathways 14 are electrically coupled to earth ground but arerelied upon to provide an inherent common conductive pathway for acircuit in which the invention is placed into and energized with. Asmentioned earlier, inserted and maintained between common conductivepathways 14 and both electrode pathways 16A and 16B is material 28 whichcan be one or more of a plurality of materials having differentelectrical characteristics.

[0100]FIG. 1A shows an alternative embodiment of multi-functional energyconditioner 10, which includes additional means of coupling electricalconductors or circuit board connections to multi-functional energyconditioner 10. Essentially, the plurality of common conductive pathways14 are electrically connected together by the sharing of a separatelylocated outer edge conductive band or bands 14A and/or 14B (not shown)at each conductive electrode exit and which in turn, are then joinedand/or connected to the same external conductive surface (not shown)that can possess a voltage potential when the invention is placed into aportion of a larger circuit and energized. This voltage potential coactswith the external conductive surface area or areas through conductivebands 14A and/or 14B (not shown) and the internal common conductiveelectrodes 14 of the embodiment, as well as any of the conductiveelements (shown or not shown) that are needed to utilize a connectionthat allows energy to propagate.

[0101] In addition, each differential electrode pathway 16A and 16B hasits own outer edge conductive bands or surface, 40A and 40Brespectively. To provide electrical connections between electrodepathway 16A and 16B and their respective conductive band 40A and 40Bwhile at the same time maintaining electrical isolation between otherportions of multi-functional energy conditioner 10, each electrodepathway 16 is elongated and positioned such that the elongated portionof electrode pathway 16A is directed opposite of the direction electrodepathway 16B is directed. The elongated portions of electrode pathways 16also extend beyond the distance in which the plurality of commonconductive pathways common conductive pathways 14 extend with theadditional distance isolated from outer edge conductive bands 40A and40B by additional material 28. Electrical connection between each of thebands and their associated pathways is accomplished through physicalcontact between each band and its associated common conductive orconductive electrode pathway, respectively.

[0102]FIG. 2 shows a quasi-schematic circuit representation of anenergized portion of a circuit when the physical embodiment ofmulti-functional energy conditioner 10 is mated into a larger circuitand energized. Line-to-line energy conditioning element 30 is comprisedof electrode pathways 16A and 16B where electrode pathway 16A is coupledto one of the pair of electrical conductors 12A with the other electrodepathway 16B being coupled to the opposite electrical conductor 12Bthereby providing the two parallel pathways necessary to form a energyconditioning element. Center common conductive pathway electrode 14 isan essential element among all embodiments or connotations of theinvention and when joined with the sandwiching outer two commonconductive pathways 14 together act as inherent common conductivepathway 34 and 34b which depicts conductive band 14 and 14B (not shown)as connecting to a larger external conductive area 34 (not shown) andline-to-line energy conditioning element 30 and also serves as one ofthe two parallel pathways for each line-to-common conductive pathwayenergy conditioning element 32.

[0103] The second parallel pathway required for each line-to-commonconductive pathway energy-conditioning element 32 is supplied by thecorresponding electrode pathway 16B. By carefully referencing FIG. 1 andFIG. 2, the energy conditioning pathway relationships will becomeapparent. By isolating center common conductive pathway electrode 14from each electrode pathway 16A or 16B with material 28 havingelectrical properties, the result is a energy conditioning networkhaving a common mode bypass energy conditioning element 30 extendingbetween electrical conductors 12A and 12B and line-to-common conductivepathway decoupling energy conditioning elements 32 coupled from eachelectrical conductor 12A and 12B to larger external conductive area 34.

[0104] The larger external conductive area 34 will be described in moredetail later but for the time being it may be more intuitive to assumethat it is equivalent to earth or circuit ground. The larger externalconductive area 34, can be coupled with the center and the additionalcommon conductive pathways 14 to join with said central pathway 14 toform, one or more of common conductive pathways 14 that are conductivelyjoined and can be coupled to circuit or earth ground by common means ofthe art such as a soldering or mounting screws inserted throughfastening apertures 22 or just laminated as a standard planarmultilayered ceramic embodiment (not shown) with externally depositedconductive material like 14A and 14B which are then together coupled tothe same external common conductive area or pathway (not shown) anenclosure or grounded chassis of an electrical device. Whilemulti-functional energy conditioner 10 works equally well with inherentcommon conductive pathway 34 coupled to earth or circuit commonconductive pathway, one advantage of multi-functional energy conditioner10's physical architecture is that depending upon energy condition thatis needed, a physical grounding connection can be unnecessary in somespecific applications.

[0105] Referring again to FIG. 1 an additional feature ofmulti-functional energy conditioner 10 is demonstrated by clockwise andcounterclockwise flux fields, 24 and 26 respectively. Maxwell's fourthequation, which is also identified as Ampere's law, states that magneticfields arise from two sources, the first source is described as currentflow in the form of a transported electrical charge and the secondsource is described by how the changes in electric fields traveling in aclosed loop circuit will subsequently create simultaneous, magneticfields. Of the two sources just mentioned, transported electrical chargeis the description of how electric currents create magnetic fields thatif the conductive source pathway and the return energy pathway are sopositioned, mathematical equations can be used to describe how E & HFields can be suppressed or minimized within the new interposer device.

[0106] To minimize RF currents within any passive component or layeredstructure that is being used in an energy transmission network, theconcept of flux cancellation or flux minimization needs to be used.Because magnetic lines of flux travel counterclockwise within atransmission line or line conductor or layer, if we bring the RF returnpath parallel and adjacent to its corresponding source trace, themagnetic flux lines observed in the return path (counterclockwisefield), related to the source path (clockwise field), will be in theopposing directions. When we combine a clockwise field with acounterclockwise field, a cancellation or minimization effect isobserved.

[0107] If unwanted magnetic lines of flux between a source and returnpath are canceled or minimized, then a radiated or conducted RF currentcannot exist except within the minuscule boundary of the conductivepathway inside. However, by using techniques described herein, thisminuscule boundary of escaping RF energy is critical in high-speedapplications and is effectively contained by the energized shieldstructure almost entirely enveloping the differential conductivepathway. The concept of implementing flux cancellation or minimizationis simple, especially when the opposing conductors can be positionedvertically and horizontally with respect to the earth's horizon, withinmicrons of distance to one another. The invention suppression orminimization techniques occurring simultaneous to one another duringflux cancellation or minimization creates and follows convention theoryas it is prescribed with the use of image planes or nodes. Regardless ofhow well designed a passive component is, magnetic and electric fieldswill normally be present to some small insignificant amount, even atspeeds above 2 Gigahertz and beyond. However, if we cancel or minimizemagnetic lines of flux effectively and than combine this cancellation orminimization technique with use of an image plane and shieldingstructures then EMI cannot exist.

[0108] To explain this concept further, the direction of the individualflux fields is determined and may be mapped by applying Ampere's Law andusing the right hand rule. In doing so, an individual places their thumbparallel to and pointed in the direction of current flow throughelectrical conductors 12A or 12B as indicated by the arrows at eitherends of the conductors. Once the thumb is pointed in the same directionas the current flow, the direction in which the remaining fingers on theperson's hand curve indicates the direction of rotation for the fluxfields. Because electrical conductors 12A and 12B are positioned next toone another and they can also represent a more than one current loop asfound in many I/O and data line configurations, the currents enteringand leaving multi-functional energy conditioner 10 oppose one another,thereby creating a closely positioned opposed flux fields 18, 20, 24, 26which cancel or minimize each other and cancel or minimize inductanceattributed to the device.

[0109] Low inductance is advantageous in modern 1/O and high-speed datalines as the increased switching speeds and fast pulse rise times ofmodern equipment create unacceptable voltage spikes which can only bemanaged by low inductance surge devices and networks. It should also beevident that labor intensive aspects of using multi-functional energyconditioner 10 as compared to combining discrete components found in theprior art provides an easy and cost effective method of manufacturing.Because connections only need to be made to either ends of electricalconductors 12 to provide a line to line capacitance to the circuit thatis approximately half the value of the capacitance measured for each ofthe line to common conductive pathway capacitance also developedinternally within the embodiment. This provides flexibility for the useras well as providing a potential savings in time and space inmanufacturing a larger electrical system utilizing the invention.

[0110] A portion of a Faraday-cage-like common conductive shieldstructure found in the present invention is shown in detail in FIG. 3and in FIG. 4. Accordingly, discussion will move freely between FIG. 3and FIG. 4 to disclose the importance that a Faraday-cage-like commonconductive shield structure plays in combination with various externalcommon conductive pathways. FIG. 3 shows a portion 800B, which comprisesa portion of the complete Faraday cage-like conductive shield structure20 as shown in FIG. 4.

[0111] In FIG. 3, differential conductive by-pass electrode pathway 809is sandwiched between the shared, central common conductive pathway804/804-IM of structure 20 and common conductive pathway 810 (not shownin FIG. 3), which is seated above pathway 809 in depiction FIG. 4.Positioned above and below by-pass pathway 809 is a dielectric materialor medium 801. Common conductive pathways 804/804-IM and 810, as well aspathway 809, are all separated from each other for the most part by ageneral parallel interposition of a predetermined dielectric material ormedium 801, which is placed or deposited during the manufacturingprocess between each of said conductive pathway applications. All of theconductive common conductive pathways 860/860-IM, 840, 804/804-IM, 810,830, and 850/850-IM are offset a pre-determined distance 814 from theouter edge of embodiment 800B. In addition, all of the differentialconductive pathways 809 are offset an additional distance 806 from theouter edge of embodiment 800B such that the outer edge 803 ofdifferential conductive pathway 809 is overlapped by the edge 805 of thecommon conductive pathways. Accordingly, differential conductive pathway809 comprises a conductive area that will always be less than any of oneconductive area of any given said common conductive pathways' conductivearea when calculating its' total conductive area. The common conductivepathways will generally all possess nearly the same as manufacturabilitycontrollable conductive area that is homogenous in area size to onanother as well in general make-up. Thus, any one of the sandwichingcommon conductive pathway's will posses a total top and bottomconductive area sum always greater than the total conductive area topand bottom summed of any one differential conductive pathway and willalways be almost completely physically shielded by the conductive areaof any common conductive pathway of Faraday-cage-like common conductiveshield structure.

[0112] Looking at FIG. 4, it is seen that common pathways 860/860-IM,840, 804/804-IM, 810, 830, and 850/850-IM are also surrounded bydielectric material 801 that provides support and outer casing of theinterposer component. Conductive connection material or structures 802Aand 802B are applied to a portion of said common shield pathwaystructures edges 805 of said common pathways of a structure 20 on atleast two sides as is depicted in FIG. 4 and as is depicted for804/804-IM in FIG. 3. This enables the electrical conditioning functionsto operate properly in this type of embodiment. A break down ofstructure 20 into even smaller, paired, cage-like conductive structureportions reveals for example conductive structure 900A which is furthercomprised of common conductive pathways 804/804-IM, 808 and 810,individually, and now together, with common conductive materialconnections 802A and 802B that will form a single, common conductive,center structure 900A of larger structure 20 that would alone, operatesufficiently as one common conductive cage-like structure of 900A, ifbuilt as such, individually and connected in a similar manner into acircuit.

[0113] To condition additional differential conductive pathways (notshown), as part of a larger stacking of a interposer utilizing commonconductive pathway electrodes could be added in a pre-determinedfashion, for by-pass as shown in FIG. 3 or for a feed-thruconfiguration, not shown, but disclosed in pending applicationsreferenced herein. All that is needed for proper device functions, aslong as conductive connection material connections 802A and 802Bmaintain physical and electrical contact with some portion of commonpathways edge electrodes 805 of each, respective, common conductivepathways and as long as each and every differential pathway issandwiched by at least two common conductive pathways and saiddifferential conductive pathways are set-back in a generally equal 806positioning so that the stacked yet separated differential electrodes,each embodiment may operate the units minimization and suppressionfunctions in a balanced manner with respect to conductive material areasas just discussed.

[0114] Returning to FIG. 4, paired, differential energy propagationshielded container comprising conductive pathways similar to 809 and 818(not shown) in FIG. 3 will utilize conductive connection material orstructures 802A and 802B that comprises a conductive material generallyknown and used in the art to electrically connect conductive pathways toone another in a typical circuit system as can be done using prior artmethodologies.

[0115] Before embodiment 20 of FIG. 4 is placed into circuitry andenergized, structures 802A and 802B should electrically connectconductive pathways to one another in a typical circuit system andprovide externally located conductive pathways or areas (not shown) orsame external conductive paths (not shown) a good electrical connectionwithout any conductive interruption or gap between each respectiveconductive structures 802A and 802B.

[0116] In FIG. 3, single cage-like structure 800B mirrors singlecage-like structure 800C except that differential electrode 818 (notshown) contained within, and exit/entrance sections 812A and 812B (notshown) as well as conductive pathway extension structures 812A and 812B(not shown), are positioned in a generally opposite placement positionrelative to one another or its paired mate in multi-paired applications,and will operate in an electrically balanced manner with one anotherconductive pathway differential electrode of conductive structure 809B(not shown) with exit/entrance section 812B (not shown) that can be in agenerally opposing direction, approx. 180 degrees to that of conductivepathway differential electrode of conductive structure 809A withexit/entrance section 812A. Differential structures contained withinthese two commonly conductive, cage-like structures or common containers800C and 800B are in a positioned and electrically parallelrelationship, but most importantly, structures 800C and 800B comprisingstructure 900A are sharing the same, central common conductive sharedpathway 804/804-IM, that makes up part of each smaller cage-likestructures, 800C and 800B, when taken individually. Together, 800C and800B create a single and larger conductive Faraday-cage-like commonconductive shield structure 900A that acts as a double or pairedshielded common conductive pathway container.

[0117] Each container 800C and 800B can hold an equal number of samesized, differential electrodes that are not necessarily physicallyopposing one another within larger structure 900A, yet are oriented in agenerally physically and electrically parallel manner, respectively.Larger, conductive faraday-cage-like common conductive shield structure900A with co-acting 800C and 800B individual shield-like structures,when energized, and attached to the same external common conductive patharea by common conductive material connections 802A and 802B by anypossible means of commonly acceptable industry attachment methods suchas reflux solder conductive epoxies and adhesives and the like (but notshown), become one electrically, at energization.

[0118] The predetermined arrangements of the common conductiveelectrodes are shown in FIG. 4, with common conductive electrode 810 and808 with a centralized common shield 804/804-IM connected by commonconductive material connections 802A and 802B to an external commonconductive pathway or area are some of the elements that make up onecommon conductive cage-like structure 900A. Common conductive cage-like800B is an element of the present invention, namely the energyconditioning interposer with circuit architecture.

[0119] The central common conductive shared pathway 804/804-IM withrespect to its interposition between the differential electrodes 809 and818 (not shown) needs the outer two additional sandwiching commonelectrode pathways 808 and 810 to be considered an un-energized, Faradaycage-like conductive shield structure 900A. To go further, the centralcommon pathway 804/804-IM will be used simultaneously by bothdifferential electrodes 809 and 818, at the same time, but with oppositeresults with respective to charge switching.

[0120] The following sections that reference to common conductivepathway 804/804-IM, also apply to common conductive pathways 808 and810. Common conductive pathway 804/804-IM is offset a distance 814 fromthe edge of the invention. One or more portions 811A and 811B of thecommon conductive pathway electrode 804/804-IM extends through material801 and is attached to common conductive band or conductive materialstructures 802A and 802B. Although not shown, common 802A and 802Belectrically connects common conductive pathways 804/804-IM, 808 and 810to each other and to all other common conductive pathways (860/860-IM,840, 830, and 860/860-IM) if used.

[0121] This offset distance and area 806 of FIG. 3, enables the commonconductive pathway 804/804-IM to extend beyond the electrode pathway 809to provide a shield against portions of energy flux fields (not shown)which might have normally attempted to extend beyond the edge 803 of theelectrode pathway 809 but were it not for the electrostatic shieldingeffect of an energized faraday-like cage systems resulting in reductionor minimization of near field coupling between other internal electrodepathways such as 818 (not shown) or to external differential electrodepathways elements. The horizontal offset 806 can be stated asapproximately 0 to 20+ times the vertical distance 806 between theelectrode pathway 809 and the common conductive pathway 804/804-IM. Theoffset distance 806 can be optimized for a particular application, butall distances of overlap 806 among each respective pathway is ideally,approximately the same, as manufacturing tolerances will allow. Minorsize differences are unimportant in distance and area 806 betweenpathways as long as electrostatic shielding function (not shown) ofstructure 900A or structure 20 is not compromised.

[0122] In order to connect electrode 809 to energy pathways positionedexternal to 809, yet on either side of the 800B, respectively (notshown), the electrode 809 may have one, or a plurality of, portions 812which extend beyond the edge 805 of the common conductive pathways804/804-IM and 808 to a connection area 812A and 812B which are in turnconductively connected to conductive pathway material, deposit orelectrode 809A and 809B, which enables the by-pass electrode 809 to beelectrically connected to the energy pathways (not shown) on eitherside. It should be noted that element 813 is a dynamic representation ofthe center axis point of the three-dimensional energy conditioningfunctions that take place within the interposer invention (not shown)and is relative with respect to the final size, shape and position ofthe embodiment in an energized circuit.

[0123] Referring now to FIG. 4, the concept of the universal,multi-functional, common conductive shield structure (for use with theapplicants discreet, non-interposer energy conditioners) is shown. Theuniversal, multi-functional, common conductive shield structure 20comprises multiple, stacked, common conductive cage-like structures900A, 900B and 900C as depicted and which in turn are comprised ofmultiple, stacked, common conductive cage-like structures or containers800A, 800B, 800C, and 800D (each referred to generally as 800X), in agenerally parallel relationship. Each common conductive cage likestructure 800X comprises at least two common conductive pathwayelectrodes, 830, 810, 804/804-IM, 808, or 840. The number of stacked,common conductive cage-like structures 800X is not limited to the numbershown herein, and can be any even integer. Thus the number of stacked,common conductive cage-like structures 900X is also not limited to thenumber shown herein and could be of an even or odd integer. Although notshown, in other applications, each paired common conductive cage-likestructure 800X sandwiches at least one conductive pathway electrode aspreviously described in relation to FIG. 3. The common conductivecage-like structures 800X are shown separately to emphasize the factthey are paired together and that any type of paired conductive pathwayscan be inserted within the respective common conductive cage likestructures 800X. As such, the common conductive cage-like structures800X have a universal application when paired together to create largercommon conductive cage-like structures 900X, which are delineated as900B, 900A and 900C, respectively and can be used in combination withpaired conductive pathways in discrete, or non-discrete configurationssuch as, but not limited to, embedded within silicone or as part of aPCB, discreet component networks, and the like.

[0124] The common conductive pathway electrodes 830, 810, 804/804-IM,808, 840, are all conductively interconnected as shown at 802A and802B(s) which provide connection point(s) to an external conductive area(not shown). Each common conductive pathway electrode 830, 810,804/804-IM, 808, 840, is formed on dielectric material 801 to edge 805and reveal opposite side bands also comprised of dielectric material801.

[0125] As has described in FIG. 3, the dielectric material 801,conductively separates the individual common conductive pathwayelectrodes 830, 810, 804/804-IM, 808, 840, from the conductive pathwayelectrodes (not shown) sandwiched therein. In addition, as described inrelation to FIG. 3, a minimum of two cages, for example 800B and 800C,which make up larger cage 900A, are required to make up amulti-functional line-conditioning structure for use in all of thelayered embodiments of the present invention. Accordingly, there are aminimum of two required common conductive cage like structures 800X, asrepresented in FIG. 4 per each 900A, 900B, and 900C, respectively. Nomatter the amount of shield layers used or the processes that derive thefinal form are arrived at, the very basic common conductive pathwaymanufacturing result of any sequence (excluding dielectric materials,etc.) should appear as an embodiment structure that is as follows: afirst common conductive pathway, then a conductive pathway (not shown),then a second common conductive pathway, second conductive pathway (notshown) and a third common conductive pathway. The second commonconductive pathway in the preceding results becomes the centrallypositioned element of the result. For additional layering of pathwaysdesired, additional results of a manufacturing sequence would yield asfollows for example, a third conductive pathway (not shown), than afourth common conductive pathway, a fourth conductive pathway (notshown); than a fifth common conductive pathway. If an image shieldconfiguration is desired to be used as is shown in FIG. 4 as pathways850/850-IM and 860/860-IM there is no difference in the first layerresult other than a last set of sandwiching common conductive pathways850/850-IM and 860/860-IM are added. Again as a result of almost anymanufacturing sequence as follows: (excluding dielectric material, etc.)860/860-IM common conductive pathway is placed, than a first commonconductive pathway, then a conductive pathway (not shown), then a secondcommon conductive pathway, second conductive pathway (not shown) and athird common conductive pathway a third conductive pathway (not shown),than a fourth common conductive pathway, a fourth conductive pathway(not shown); than a fifth common conductive pathway, finally a850/850-IM common conductive pathway will be the resulting structure forthis example in FIG. 4. In summary, most chip, non-hole thru embodimentsof the applicants discreet, non-interposer energy conditioners will havea minimum of two electrodes 809 and 809′ (not shown) sandwiched betweenthree common conductive electrodes 808 (not shown) and 804/804-IM and810 (not shown), respectively, and a minimum of two electrodes 809 and809′ (not shown) connect to external structures 809A and 809A′ (notshown). Three common conductive electrodes 808 (not shown) and804/804-IM and 810 (not shown), respectively and connected externalstructures 802A and 802B are connected such that they are conductivelyconsidered as one to form a single, larger Faraday-cage-like structure900A. Thus when a single, larger Faraday-cage-like structure 900A isattached to a larger external conductive area (not shown), thecombination helps perform simultaneously, energized line conditioningand filtering functions upon the energy propagating along the conductors809 and 809′ (not shown), sandwiched within the cage-like structure900A, in an oppositely phased or charged manner. Connection of thejoined common conductive and enveloping, multiple common shield pathways808 (not shown) and 810 (not shown), respectively with a commoncentrally located common conductive pathway 804/804-IM will become likethe extension of external conductive element 6803, as shown in FIG. 5Band will be interposed in such a multiple parallel manner that saidcommon conductive elements will have microns of distance separation or‘loop area’ with respect to the complimentary, phased differentialelectrodes that are sandwiched themselves and yet are separated from theextension of external conductive element like 6803, shown in FIG. 5B bya distance containing a dielectric medium.

[0126] This enables the extension of external conductive element like6803, shown in FIG. 5B to perform electrostatic shielding functions,among others, that the energized combination as just described willenhance and produce efficient, simultaneous conditioning upon the energypropagating on or along said portions of assembly 900A's differentialconductors 809 and 809″ (not shown). The internal and external parallelarrangement groupings of a combined common conductive 900A will alsocancel or suppress unwanted parasitics and electromagnetic emissionsthat can escape from or enter upon portions of said differentialconductors differential conductors 809 and 809′ (not shown) used by saidportions of energy as it propagates along a conductive pathways (notshown) to active assembly load(s), which is explained further, belowwith FIG. 5A.

[0127] Referring now to FIGS. 5A and 5B, a further embodiment of thelayered, universal, multi-functional common conductive shield structureof the present invention is shown in a by-pass configuration 6800hereinafter referred to as “by-pass shield structure”. By-pass shieldstructure 6800 could also take on a configuration of ‘feed-thru shieldstructure” 6800 in terms of relative stacking position of a staticembodiment of each. There would be relatively no difference betweenthese two possible configurations when inspecting the positioning ofstacked two common conductive shield structures 1000A and 1000B or ofcommon conductive pathways 6808, 6810, 6811, 6812 and central commonshared conductive pathway 6804 that could make up each embodiment. Whileappearing physically similar in arrangement “feed-thru shield structure”6800 and ‘by-pass shield structure” 6800, each would still yield thesame possible functional contribution to the energy conditioning of acircuit. However, the way to which the non-common pathways 6809 and 6807are constructed and subsequently positioned with respect to circuitpathway attachments would also determine the final type of energyconditioning results that could be expected in the circuit. Whateverconfiguration, the various shielding functions, physical and electrical,work about the same way with respect to propagated energy (not shown) inthe AOC of By-pass shield structure 6800.

[0128] Referring specifically to FIG. 5A, the by-pass shield structure6800 is shown in cross section extending longitudinally and comprises aseven layer common conductive pathway stacking of two common conductiveshield structures 1000A and 1000B, which form the present embodiment ofthe by-pass shield structure 6800. In FIG. 5B, the by-pass shieldstructure 6800 is shown in cross section perpendicular to the crosssection shown in FIG. 5A.

[0129] Referring to both FIGS. 5A and 5B, the by-pass shield structure6800 comprises a central common conductive shared pathway 6804 that isconnected with elements 6808, 6810, 6811, 6812 and energized and willform a zero voltage reference to circuitry (not shown) with the creationof 6804-IM, 6811-IM and 6812-IM which is formed and relative only to theactive circuit elements attached commonly (not shown), but not beforeconnection of the 6802A and 6802B (s) by connection means 6805 toexternal conductive surface 6803. With energization, the circuitry (notshown) will include a passively operating universal, multi-functional,common conductive shield structure 6800 that will be used by energysource (not shown) and energy-utilizing load (s) with propagated energyin a balanced manner that will be available when energized activecomponents (not shown) in said circuitry (not shown) demand portions ofsaid energy. Elements as just described including portions of all of thecommon conductive elements in the chain of connections to 6803 as justdescribed will have created for said energized circuit elements 6807,6820, 6809, 6821, a zero voltage reference, 6811-IM, 6804-IM, 6812-IMrespectively, and with central common conductive shared pathway 6804,electrically balance coupled energy within the circuit (not shown) withthe formation of a third but common electrical node, separate of the twodistinct and separate differential nodes utilized by differentialconductive pathways 6809 and 6807 and their respective conductivelylinking elements 6820 and 6821.

[0130] In order to couple by-pass shield structure 6800 to an energizedcircuit, differential conductive pathways 6807 and 6809, respectively,are each inserted into one of the two common conductive shieldstructures. The first common conductive shield structure 1000A is formedbetween common conductive pathway 6810 and central common conductiveshared pathway 6804. The second common conductive shield structure 1000Bis formed between common conductive pathway 6808 and central commonconductive-shared pathway 6804. To use by-pass shield structure 6800 afirst differential conductive pathway 6807 is placed within the firstcommon conductive shield structure and separated from the commonconductive pathway 6810 and the central common conductive-shared pathway6804 by a dielectric material 6801. The dielectric material 6801separates and electrically isolates the first differential conductivepathway 6807 from the first common conductive shield structure. Inaddition, a second differential conductive pathway 6809 is placed withinthe second common conductive shield structure and separated from thecommon conductive pathway 6808 and the central common conductive-sharedpathway 6804 by a dielectric material 6801.

[0131] The first and second differential conductive pathways 6807 and6809, respectively, are then electrically connected to externalconductive energy pathways 6820 and 6821, respectively. The electricalconnections can be made by any means known to a person of ordinary skillin the art, including but not limited to solder, resistive fit sockets,and conductive adhesives. Completing the by-pass shield structure 6800are the additional outer shield structures 6811 and 6812, which sandwichboth common conductive shield structures 1000A and 1000B with dielectricmaterial 6801 interposed between. Each of the outer common conductiveshields 6811 and 6812 form image structures 6811-IM and 6812-IM as justdescribed, when energized, that includes an outer conductive portion ofshields 6811 and 6812 (not shown) and the outer conductive portions ofexternal common conductive electrode structure(s) 6802A and 6802B thatforms a relatively large skin area and a zero voltage reference with6804-IM by external common conductive structure 6803. The outer skinsurface formed by the combination of the external common conductiveelectrode structure 6802A and 6802B and the outer shield imagestructures 6811-M and 6812-M absorbs energy when the circuit isenergized and than act as an additional enveloping shield structure withrespect to 6809 and 6807 differential conductive pathways. If theby-pass shield structure 6800 is attached to an external commonconductive pathway 6803 of an energy conditioning circuit assembly(‘ECCA’) by known means 6805, such as solder material, portions ofenergy will travel along the created low impedance pathway that existsinternally, with common conductive structure elements 6812, 6808, 6804,6810, 6811 6802A and 6802B, and the external connection 6805 to thirdconductive pathway 6803 and be able to return by this pathway 6803 toits source.

[0132] The external common conductive electrode structure(s) 6802A and6802B are connected to electrical circuits by means known in the art andtherefore the present invention is not limited to discreet structuresbut could, for example, be formed in silicon within an integratedcircuit. In operation, by-pass shield structure 6800 and the two commonconductive shield structures 1000A and 1000B, effectively enlarge thezero voltage reference 6804-IM, 6811-IM and 6812-IM within the area ofconvergence AOC 6813. The AOC 6813 is the energy central balance pointof the circuit.

[0133] The result of the by-pass shield structure 6800 when energizedwithin a circuit is increased physical shielding from externallygenerated and internally propagating parasitics 6816 (represented by thedouble sided arrows) as well as providing lower impedance pathsgenerated along the common conductive pathway electrode 6812, 6808,6804, 6810, 6811 6802A and 6802B, surfaces to external conductivepathway 6803. The electrostatic functions (not shown) occur in anenergized state to energy parasitics 6816, which are also representativeof portions of externally and internally originating energy parasitics6816 that would otherwise disrupt portion of propagated energy. Thedouble-sided arrows show the charged electron exchange representative ofthe electrostatic functions that occur in an energized state to trapparasitics 6816 within a shielded container. The double-sided arrowsalso represent the simultaneous, but opposite charge affect that occursalong the ‘skins’ of the conductive material that is located within eachrespective container.

[0134] Turning now to FIG. 6A, a layering sequence of a surface mountenergy conditioning interposer 30 with circuit architecture is shown.Interposer 30 comprises a minimum of two differential conductivepathways 303, 305. Interposer 30 also comprises a minimum of threecommon conductive pathway layers 302, 304, 306, which are electricallyinterconnected and surround the differential conductive pathways 303,305, both above and below, to form a large Faraday cage-like commonconductive shield structure about each paired differential pathways, ashas been previously disclosed. In one embodiment, interposer 30 alsocomprises an additional common conductive pathway layer 301/301-IM,307/307-IM, or image shield layer, stacked on the outer commonconductive pathway layers 302 and 306. These image shield layers301/301-IM, 307/307-IM are also electrically interconnected to the othercommon conductive pathway layers 302, 304, and 306. The centrallypositioned common conductive pathway 304 separates differentialconductive pathways 303, and 305. Common conductive pathway 304 isshared such that it forms a portion of a Faraday cage-like conductiveshield structure surrounding both the first and second differentialconductive pathways 303 and 305.

[0135] Each common conductive pathway layer 301/301-IM, 302, 304, 306,307/307-IM comprises a conductive electrode material 400 deposited in alayer surrounded on at least a portion of a perimeter thereof by aninsulation band 34. Insulation band 34 is made of a non-conductivematerial or dielectric material. Protruding through the insulation bands34 on the perimeter of each common conductive pathway layer 301/301-IM,302, 304, 306, 307/307-IM are electrode extensions 32, 35 whichfacilitate connections between the common conductive pathways and I/0 ofvarious IC chips (not shown) in addition to other external connectionsto common conductive pathways or other shields. Similarly, first andsecond differential conductive layers 303, 305 comprise a conductiveelectrode material 400 deposited in a layer surrounded on at least aportion of a perimeter thereof by an insulation band 37 and 38,respectively. Insulation bands 37 and 38 are made of a non-conductivematerial, dielectric material, or even can be simply an absence ofconductive material on the same layer of material that the conductivematerial resides upon. It should be noted that insulation bands 37 and38 are generally wider than insulation band 34 of the common conductivepathway layers 301/301-IM, 302, 304, 306, 307/307-IM such that there isan overlap or extension of the common conductive pathway layers beyondthe edge of the first and second differential conductive pathways as hasbeen previously discussed. First and second differential conductivelayers 303, 305 include multiple location electrode extensions 36 and39, respectively, which facilitate connections to the internalintegrated circuit traces and loads in addition to connections to theexternal energy source and/or lead frame.

[0136] As with previous embodiments, the layers 301/301-IM, 302, 303,304, 305, 306, and 307/307-IM are stacked over top of each other andsandwiched in a parallel relationship with respect to each other. Eachlayer is separated from the layer above and below by a dielectricmaterial (not shown) to form energy conditioning interposer 30.

[0137] In FIG. 6B, an integrated circuit 380 is shown mounted in acarrier, in the form of an IC or DSP package 310 configured withconnected wire pin outs (not shown). As generally indicated at 300, anintegrated circuit die is placed within IC package 310 with one sectionremoved and exposed for viewing of the internal and externalinterconnections features displaying the finished energy conditioninginterposer 30 of FIG. 6A. Interposer 30 includes electrode terminationbands 320 and 321 to which all of the common conductive pathways arecoupled are connected together at their respective electrode extensions32 and 35. These common conductive electrode termination bands 320 and321 can also be connected to a metalized portion of the IC package 310and used as a “0” voltage reference node or connected to the circuit forportions of energy leaving the interposer 30 to an external connection(not shown) that serves as the low impedance pathway return. Interposer30 also comprises differential electrode termination bands 330corresponding to the first differential electrode 303 and terminationbands 340 corresponding to the second differential electrode 305.Differential electrode termination bands 330 and 340 are utilized forreceiving energy and provide a connection point for connections toenergy-utilizing internal loads 370 of the IC die 380. It should benoted for the sake of depiction herein that interposer 30 is normallyphysically larger than the active component or IC it is attached to andconditioning energy for.

[0138] While there are many IC package pin-outs 350 located around theIC carrier edge 392 for signal in return pathways, there is only onepin-out utilized for energy entry, designated at 391B, and only onepin-out utilized for energy return, designated at 391A. The IC package310 is designed such that multiple power entry points are reduced to onepair of power entry/return pins 391A and 391B which are connected to thedifferential electrode termination bands 340 and 330, respectively, bybond wires 393A, 393B or other conductive pathways, or conventionalinterconnects. The single power entry portal represented by pins 391Aand 391B and the proximity of the electrode termination bands 330 and340 of interposer 30 to the power entry portal reduces the noise thatcan enter or exit the integrated circuit and interfere with circuitryboth internal or external to the integrated circuit package 310. Theconnections are by standard means known in the art such as, but notlimited to, wire bond jump wires and the like and is determined by thefinal application needs of a user.

[0139] Turning to FIG. 7, and cross-sectional views of variedembodiments of FIG. 7, which are FIG. 8A and FIG. 8B, the applicantswill move freely between all three drawings explaining interposer60/61's, functions and makeup for the embodiments show herein.

[0140] In FIG. 7, interposer 60/61 is shown in this case a top viewdepiction and it is quickly noted that in most cases, but not all, theopposite sides view or appearance of interposer 60/61 is approximatelythe same as is shown in FIG. 7 the top view.

[0141] In one embodiment of the present invention, referring now to FIG.7, interposer 60/61 comprises vias 63, 64 and 65, which provideconductive energy propagation pathway interconnections through aplurality of substrate layers within the body of interposer 60/61encased in material 6312 and surrounded by conductive material 6309.This embodiment typically utilizes either a paired path or a three-pathconfiguration. In a paired, or two path configuration, interposer 60/61utilizes a paired two-way I/O circuit pathway using both VIAS 64 andVIAS 65 for IN energy propagation pathways, while using VIAS 66 for theOUT energy propagation pathways. Circuit reference nodes (not shown)could be found and utilized inside or adjacent to the AOC of interposer60/61 by a portion of internal conductive pathways (not shown)pre-determined by the user for portions of propagating energy servicingthe load or from inside the AOC, depending on exact connection circuitryoutside the interposer 60/61.

[0142] A three-way conductive pathway I/O configuration is preferred anduses VIAS 65 for IN energy propagation, VIAS 64 for OUT pathed energypropagation or energy return, and uses the center VIAS 66 as a separate,common energy propagation pathway and reference attachment. VIAS 66allow portions of energy propagating in either direction between anenergy-utilizing load (not shown) and an energy source (not shown) tomove to a low impedance energy pathway created within the AOC that canbe pathed along externally designated common conductive pathways orareas outside of the AOC that would provide or share voltage potentialfor the circuitry within the interposer's AOC. This low impedance energypathway, or area, is created as energy from external pathway circuitryis transferred through differential pathways 60C and 60D and continueson to external conductive pathways on either one or multiple sides ofinterposer 60/61. Portions of this energy propagating within the AOC ofinterposer 60/61 propagate to common conductive pathways 6200/6200-IM,6201, 6202, 6203 and 6204/6204-IM and VIAs 66, which interconnects thecommon conductive pathways within the AOC of 60 in this case and allowsthe energy to propagate along to external common conductive pathways.

[0143] Depending on usage, there are some embodiment variations ofinterposer 61/60 not depicted in FIG. 8B and FIG. 8A, but are easilycontemplated by the applicants that would have an IC mounting side only,with vias 64,65,66 configured to that shown in FIG. 7. Yet, depending onthe external pathway connections that are to be made or utilized, avariant of interposer 60, an alternative invention interposer might onlycomprise one, two or three of the 64,65,66 conductive via groups withthe same or alternate couplings to the perpendicularly disposed internalhorizontal conductive pathways such as common pathways 6200/6200-IM,6201,6202, 6203 and 6204/6204IM, 60C and 60D.

[0144]FIG. 8B shows the common conductive via pathways 66 penetratingcompletely through to the opposing side 6312, yet a simple 2 way pathwayconfiguration could utilize all 64 and 65 configured vias, (no via 66penetrating to the opposing side 6312, but coupling just to the commonpathways 6200/6200-IM, 6201,6202, 6203 and 6204/6204-IM, created) asjust energy input pathways, while using the side conductive pathway 6308created by the joining of common pathways 6200/6200-IM, 6201,6202, 6203and 6204/6204-IM at 6308 as a return energy path, passing through fromthe vias 66 located as shown in FIG. 7 and moving through the internalAOC of device 60 and finally propagating outside the internal AOC ofdevice 60 as portions of the energy return to its source by externallyattached conductive pathways (not shown) such as wire bondings made tomaterial 6308 or conductive attachment nodes (not shown). It should alsobe noted that dotted line 60E represents interposer embodiment 61 orsimilar boundary or demarcation line of its non-penetratingconfiguration of common conductive pathways 6200/6200-IM, 6201,6202,6203 and 6204/6204-IM that do not make a conductive attachment within to6309 located on 6312S portions of interposers 60 & 61 and make couplingconnections only to vias 66 as shown in FIG. 8A, and not to material6308 as is shown for common conductive pathway electrodes 6200/6200-IM,6201,6202, 6203 and 6204/6204-IM in FIG. 8B of interposer 60. Ininterposer 61 it must be emphasized that the common conductive pathwayelectrodes 6200/6200-IM, 6201,6202, 6203 and 6204/6204-IM do notpenetrate material dielectric or insulative 6209 and emerge out to 6312Sof this embodiment to join with conductive material 6309 that is appliedon interposer embodiment 60 as shown on FIG. 8B. However, these commonconductive pathway electrodes 6200/6200-IM, 6201,6202, 6203 and6204/6204-IM still extend closer to 6312-S than do the 60D and 60Cdifferential pathways as demarcated or delineated by dotted line 60F inFIG. 7. Because of this positioning of the differential and commonpathways to one another interposers of the new invention will partake inthe electrostatic shielding functions attributed to these types ofpathway configurations, many of which are similarly described in detailwithin this disclosure.

[0145] These various pathway configurations reveal the versatility ofthe device and the that while the common conductive pathways6200/6200-IM, 6201,6202, 6203 and 6204/6204-IM appear to have a limitedpositioning criteria, it must be noted that pathway vias 64,65,66 aremuch more flexible and versatile in positioning configurations, shape,sizes, and can be utilized to provide all sorts of energy conditioningfunctions and pathway configurations as one in the art or not can dreamup. Interposer 60/61 is configured in a way that uses a multi-aperture,multilayer energy conditioning pathway sets and substrate embodiment ina substrate format for conditioning propagating energy along pathwaysservicing an active element such as, but not limited to, an integratedcircuit chip or chips. Interposer 60/61 conditions propagating energy byutilizing a combined energy conditioning methodology of conductivelyfilled apertures known in the art as VIAs, in combination with amulti-layer common conductive Faraday cage-like shielding technologywith partially enveloped differential conductive electrodes or pathways.Interconnection of the substrate to the IC and to a mounting structureis contemplated with either wire bonding interconnection, flip-chipball-grid array interconnections, microBall-grid interconnections,combinations thereof, or any other standard industry acceptedmethodologies.

[0146] As shown in FIGS. 7 and 8B, conductive material 6309 can beapplied or deposited on side 6312S of Interposer 60 and can be utilizedas an auxiliary energy return pathway. At energization, commonconductive pathways 6200/6200-IM, 6201, 6202, 6203, 6204/6204-IM, VIAs66, all shown in FIG. 8B, will form a path of least impedance withrespect to the higher impedance pathways located along differentialconductive pathways 60C and 60D as well as VIAS 65 or 64.

[0147] Thus, when energized, common conductive pathways 6200/6200-IM,6201, 6202, 6203, 6204/6204-IM, VIAs 66 all shown in FIG. 8B and FIG. 8Aare utilized as the “0” Voltage circuit reference node (not shown) foundboth inside and outside the common conductive interposer energy pathwayconfigurations (not shown) as the interposer is electrically positionedin an energized circuit.

[0148] Interposer 60 is connected to an integrated circuit 4100 bycommonly accepted industry connection methods. On one side of interposer60, the various differentially conductive pathways including vias 65 areelectrically connected between the energy source (not shown) and a load(not shown) and the various differentially conductive pathways includingvias 64 are connected by common industry means between the energyutilizing load (not shown) and the energy source (not shown) on a returnpathway that includes conductive pathway vias 66 for portions ofpropagating energy. It is understood in the art that vias 65 and 64poses no polarity charge before hook-up that would prevent each fromchanging energy propagation functions such as from In put to an outputfunction as long as consistency in species hook up is maintained, onceinitiated on the device.

[0149]FIG. 8A shows interposer 61 taken from a cross sectional view “A”of a main embodiment of energy conditioning interposer taken from FIG. 7surrounded by non conductive exterior surface 6312. Interposer 61comprises conductive differential energy pathway electrode 60-C that iscoupled to conductive VIA pathway 64 and conductive differential energypathway electrode 60-D that is coupled to conductive VIA pathway 65,each as designated at 6205 by standard industry known means.Differential energy pathway 60-C and differential energy pathway 60-Dare separated from each other by central, shared, common conductiveenergy pathway 6202 and from the top and bottom of the interposer 61 bycommon conductive energy pathways 6200/6200-IM, 6201, and 6203,6204/6204-IM, respectively. The common conductive energy pathways6200/6200-IM, 6201, 6202, 6203, and 6204/6204-IM, are interconnected byconductive VIA pathway 66 as designated at 6308 by standard industryknown means. The outer most common conductive energy pathways6200/6200-IM and 6204/6204-IM act as image shield electrodes and arevertically spaced from their adjacent common conductive energy pathways6201, 6203, respectively, as designated by 4011. Conductive via pathways64, 65, and 66 are selectively isolated in a predetermined manner fromcommon conductive energy pathways and differential conductive pathwaysby a gap 6307 which is space filled with dielectric medium or isolativeor insulating material and can either be an actual deposited material orsimply a void of conductive material that would prevents coupling of thevarious conductive interposer pathways.

[0150] It should be noted that conductive via pathways 64, 65 passesthrough the various conductive and dielectric material and isselectively coupled to interposer 61's conductive differential energypathway electrodes as needed by the user. VIAs 64 and 65 can be chosento receive energy input, either output or image pathway duties as neededwith via 66. Conductive VIA pathways 64, 65, and 66 are electricallyconnected to external elements as previously discussed. Theseconnections can be any industry-accepted type of connection. As shown inFIGS. 8A and 8B, a connection is made by applying adhesive or solderball flux 4005, or an industry accepted contact material the of the forconductive seating pad 63 for gravity or adhesive placement processingusing solder balls 4007 which is a eutectic-type solder ball or industrystandard equivalent.

[0151] Now turning to FIG. 8B, interposer 60 is shown identical to thatinterposer 61 shown in FIG. 8A except that common conductive edgetermination material 6309 extends along the sides of the interposer andsurrounds the perimeter thereof as shown previously in FIG. 7. Also notethat common conductive edge termination material 6309 is electricallyconnected to common conductive energy conditioning pathways6200/6200-IM, 6201, 6202, 6203 and 6204/6204-IM and not done in FIG. 8A.Interposer 60 is also shown connected to an integrated circuit die 4100.The integrated circuit die 4100 is also shown with protective globcoating or encapsulment material 6212 just above the die surface. Theenergy conditioning interposer 60 is also mounted on a substrate 8007 orsubstrates to which the IC assembly will be attached either by ballgrids 8009 and 8010 or by other means commonly used in the industry. TheIC package pins 8009 provide interconnection to a substrate or socketconnector containing signal and ground connections not necessarily goingto interposer pathways, while 8010 pathway connections although notshown, could connect to interposer pathways for energy propagation. Itshould be noted that 4011 is the predetermined layering used or pathwayspacing that is part of the invention consideration, universally. Theseinterconnections are only to offer that they can be varied as to anystandard industry means of connecting an IC package to a PCB, PCB cardand the like. In the cases of MCM or SCM interconnections, interposer 60or 61 can be directly attached to substrate circuitry with standardindustry methodologies.

[0152] In FIG. 9, a close up of a portion of FIG. 8A reveals some of theactual external interconnecting elements for the VIA structures64,65,66. It should be noted that the internal conductive pathways aretypical but the coupling points are not shown herein. On-conductivematerial 6209 is also called out. Conductive capture pad 63 is disposedon one side of the non-conductive portion 6312 of the interposer 61around conductive pathway via 66, which comprises a small diametershaped pathway of conductive material 66A that is selectively coupled6308 or non-coupled 6307 by standard means known in the art, eitherafter vias are created either by a laser or drilling process that leavesa void for filling with material 66′ during the manufacturing process orat the same time deposit of 66′ is made that couples 6308 to commonconductive pathways 6200/6200-IM, 6201, 6202, 6203 and 6204/6204-IM asshown in FIG. 8A. A capture pad 63 is also formed on the opposite sideopening of the non-conductive material 6312 of the interposer 61 thatcoincides with conductive pathway via 66 leading to conductive capturepad 63 which is also deposited on the bottom of interposer 61. Anadhesive solder ball flux an industry accepted contact material orprimer 4005 is then applied and subsequently followed by application ofconductive solder ball 4007 of the type commonly found in the art.

[0153] It is important to note that the actual manufacturing processused to make an invention embodiment 60 or 61 and subsequently attach itto an active chip, chips or IC and than to a mounting substrate can beaccomplished in many ways. Rather FIG. 9 is an attempt to merelyoutline, in general terms, some of the many mounting procedures andconnection materials that can be used, added, removed or areinterchangeable and widely varied from manufacturer to manufacturer.Attachment materials and methodologies, overall for interposer inventiondescribed herein are not limited in any way. The critical nature ofinvention functionality, rather is simply determined more on the actualattachment arrangements made for the differently grouped, commonconductive pathways and the differential conductive pathways to theexternal conductive pathways respectively, located outside the AOC thatare key elements so long as energy pathways are conductively nominal forenergy propagation.

[0154] Referring now to FIG. 10, the exterior, or underside of a priorart IC package is shown using an assembly of externally mounted,multiple low inductance capacitive devices 8001 utilized in a prior artconfiguration with the internally located prior art interposer. The ICpackage exterior 8007 is a standard configuration where pin outs emergefrom one portion of the device for attachment to a mounting substrate,PCB or daughter card assembly, while other energy pathways utilizeeither combinations of ball grid sockets 8006 and pin outs or simplysockets 8006 while conductive pin-outs are used by other pathways suchas signal lines, for example or other standard means used in theindustry. Ball grid sockets 8004 are typically comprised for receipt ofeutectic solder or the like and are typically configured around theinner region of the IC package 8002 rather than the exterior regions of8007 to be closer for energy delivery to the internally mounted activechip or IC (not shown). The ball grid sockets 8004 are located within aperimeter or outline 8003 of the internal area location of the IC andinterposer within the IC package 8007 as designated. Within theperimeter outline, ball grid sockets 8004 for interconnection arenormally for energy supplying power by the I/O pathways 8005 of the ICpackage 8007. This prior art IC package is intended to show that theinternally positioned prior art interposer (not shown) requires anassembly 8001 of low inductance capacitive array chip device in location8002 to function properly.

[0155] In contrast, referring now to FIG. 11, the exterior, or undersideof an IC package 8007 is utilizing an embodiment of the presentinvention mounted inside IC package 8007 as is shown, “ghosted” for easeof description. As before, the perimeter outline 8003 designates thelocation of the IC and interposer 8006 within the IC package 8007 andthe perimeter is surrounded by ball grid sockets 8004. The mountedmulti-aperture energy conditioning architecture device 60-61 or similaris shown as a interposer located between the integrated circuit or ICassembly (not shown) and the mounting substrate or in this depiction themounting substrate used is the final layering or groups of layeringmaking up the outside portion of substrate package 8007. It should benoted that interposer 60-61 or similar can also be utilized to providefor an additional physical shielding function utilized by the active ICchip or chips connected to said interposer as well as it also providesthe simultaneous energy conditioning functions as described in thedisclosure. Shielding of this nature is accomplished by interposers merepresence in the package as long as the active chip (not shown) does nothave portions of its embodiment extending beyond the perimeter ofinterposer invention. Device 60 includes apertures 64 connected tointernal energy conditioning electrode(s) 60C and apertures 65 connectedto internal energy conditioning electrode(s) 60D. Conductive apertures66 are connected to common conductive pathways 6200/6200-IM, 6201, 6202,6203, and 6204/6204-IM or any additional pathways of the similar usethat are utilized.

[0156] It should be noted that in all embodiments, it is optional butpreferred that one set of outer common conductive pathways or layersdesignated as -IM should sandwich the entire stacking configuration,either placed in the manufacturing process of the entire device, perhapsutilized from part of the mounting substrate serving as a platform otherthan a discrete IC package or the IC package itself or even by utilizingan external conductive pathway or larger external conductive area, aloneor with insulating material disposed between to take the place of atleast one of the two outer common conductive pathways designated -IM.The prime set of outer common conductive pathways not designated as -IMand closely positioned to the described set of outer are critical to thedevice as the common conductive pathways that form the basis of thesidelining electrode sandwich and can only be made optional in caseswhere the final shield is replaced or substituted with an externalconductive area that can fit most of the criteria described to allow thefaraday cage-like shield structure to maintain integrity with respect tothe energy conditioning functions desired. However in the case of the-IM designated shields they are optional yet desirable in that they willelectrically enhance circuit conditioning performance and further shiftoutward the new interposers' self resonate point and enhance thatportion of the circuit located within the AOC of the invention, as well.

[0157] It should be noted that if the common conductive containerstructures that make up an invention are in balance according to theresult of the stacking sequence as described herein, any added or extra,single common conductive shield layers designated -IM beyond the primaryset of common conductive pathways that are added by mistake or withforethought will not degrade energy conditioning operations severely andthis condition in some cases can actually reveal a potential costsavings in the manufacturing process, wherein automated layeringprocesses could possibly added one or more additional outer layer orlayers as described and where the application performance may not be ascritical.

[0158] It is disclosed that these errors, intentional or accidental willnot detrimentally harm the balance of the invention containing theminimum properly sequenced stacking of common conductive pathways asdiscussed and is fully contemplated by the applicants.

[0159] At least five or more, distinctly different energy conditioningfunctions that can occur within any variation of the invention;electrostatic minimization of energy parasitics by almost total shieldenvelopment; a physical shielding of portions of the differentialconductive pathways; an electromagnetic cancellation or minimizationshielding function or mutual magnetic flux cancellation or minimizationof opposing, closely positioned, differential conductive pathway pairs;utilization of a “0” voltage reference created by the central, commonand shared pathway electrode, the sandwiching outer first set of commonconductive pathways and any of the -IM designated pathways that areutilized as part of two distinct common conductive shield structurecontainers; a parallel propagation movement of portions of energyproviding a shielding effect as opposed to a series propagation movementof energy effect of the portions of energy located within the AOC. Aparallel propagation movement of portions of energy occurs whendifferentially phased energy portions operate in an opposing, yetharmonious fashion with said energies divide such that approximately ½half of the total energies or portions found at any onetime within theAOC of the invention will be located on one side of the central commonand shared conductive energy pathway in a electrical and/or magneticoperation utilizing its parallel, non-reinforcing counterpart thatoperates in a generally opposing cancellation or minimization-typemanner or in a manner that does not enhance or create detrimental forcesin a manner like that of the prior art which operates in a generallyseries-type manner despite the usage in a few cases of a mutual magneticflux cancellation or minimization technique of opposing differentialconductive pathway. Prior art due to its structure all but fails toutilize the simultaneous sandwiching electrostatic shielding functioninherent in the new invention as has been described in this disclosure.

[0160] In all embodiments whether shown or not, the number of pathways,both common conductive pathway electrodes and differential conductivepathway electrodes, can be multiplied in a predetermined manner tocreate a number of conductive pathway element combinations a generallyphysical parallel relationship that also be considered electricallyparallel in relationship with respect to these elements in an energizedexistence with respect to a circuit source will exist additionally inparallel which thereby add to create increased capacitance values.

[0161] Next, additional common conductive pathways surrounding thecombination of a center conductive pathway and a plurality of conductiveelectrodes are employed to provide an increased inherent commonconductive pathway and optimized Faraday cage-like function and surgedissipation area in all embodiments.

[0162] Fourth, although a minimum of one central common conductiveshield paired with two additionally positioned and sandwiching commonconductive pathways or shields are generally desired and should bepositioned on opposite sides of the central common conductive shield(other elements such as dielectric material and differential conductiveelectrode pairs, each positioned on opposite sides of said centralcommon layer can be located between these shields as described).Additional common conductive pathways can be employed such as the -IMdesignated shields that do not have a differential conductive pathwayadjacent to its position with any of the embodiments shown and is fullycontemplated by Applicant.

[0163] Finally, from a review of the numerous embodiments it should beapparent that the shape, thickness or size may be varied depending onthe electrical characteristics desired or upon the application in whichthe filter is to be used due to the physical architecture derived fromthe arrangement of common conductive electrode pathways and theirattachment structures that form at least one single conductivelyhomogenous Faraday cage-like conductive shield structure with conductiveelectrode pathways.

[0164] Although the principals, preferred embodiments and preferredoperation of the present invention have been described in detail herein,this is not to be construed as being limited to the particularillustrative forms disclosed. It will thus become apparent to thoseskilled in the art that various modifications of the preferredembodiments herein can be made without departing from the spirit orscope of the invention as defined by the appended claims.

What is claimed is:
 1. An energy conditioning interposer componentassembly comprising: a plurality of common electrodes each having aplurality of conductive apertures there through, wherein said pluralityof common electrodes comprises at least a central common electrode, afirst common electrode, and a second common electrode; at least one pairof differential electrodes each having a plurality of conductiveapertures there through, wherein said at least one pair of differentialelectrodes comprises at least a first differential electrode and asecond differential electrode; wherein said first differential electrodeis stacked above said central common electrode and said seconddifferential electrode is stacked below said central common electrode,wherein said first differential electrode and said second differentialelectrode sandwich said central common electrode; wherein said firstcommon electrode is stacked above said first differential electrode andsaid second common electrode is stacked below said second differentialelectrode; a material having predetermined electrical properties,wherein said material is maintained between said plurality of commonelectrodes and said first and second differential electrodes preventingdirect electrical connection between said plurality of common electrodesand said first and second differential electrodes; wherein said firstdifferential electrode is electrically connected to a first conductiveaperture of said a plurality of conductive apertures wherein said firstconductive aperture provides an electrical connection to an externalelectrical circuit and wherein said first conductive aperture isinsulated from said second differential electrode and said plurality ofcommon electrodes; wherein said second differential electrode iselectrically connected to a second conductive aperture of said aplurality of conductive apertures wherein said second conductiveaperture provides an electrical connection to an external electricalcircuit and wherein said second conductive aperture is insulated fromsaid first differential electrode and said plurality of commonelectrodes; wherein said plurality of common electrodes are electricallyinterconnected to a third conductive aperture of said a plurality ofconductive apertures wherein said third conductive aperture is insulatedfrom said first differential electrode and said second differentialelectrode; and said plurality of common electrodes and said at least onepair of differential electrodes form a plurality of energy conditioningelements.
 2. An energy conditioning interposer circuit assemblycomprising: a plurality of common electrodes, wherein said plurality ofcommon electrodes comprises at least a central common electrode, a firstcommon electrode, and a second common electrode; at least one pair ofdifferential electrodes, wherein said at least one pair of differentialelectrodes comprises at least a first differential electrode and asecond differential electrode; wherein said first differential electrodeis stacked above said central common electrode and said seconddifferential electrode is stacked below said central common electrode,wherein said first differential electrode and said second differentialelectrode sandwich said central common electrode; wherein said firstcommon electrode is stacked above said first differential electrode andsaid second common electrode is stacked below said second differentialelectrode; wherein said first differential electrode and said seconddifferential electrode include a plurality of electrode terminationextensions protruding through an insulation band extending about theperimeter of each electrode, wherein said electrode terminationextensions provide an area for conductive attachment to an externalenergy utilizing circuit; and said plurality of common electrodes andsaid at least one pair of differential electrodes form a plurality ofenergy conditioning elements.
 3. The energy conditioning interposercomponent assembly as recited in claim 1, further comprising at least aintegrated circuit for conductive connection.
 4. The energy conditioninginterposer component assembly as recited in claim 1, wherein the ratioof said common electrodes to said differential electrodes is 3:2.
 5. Anenergy conditioning interposer for energized circuitry comprising: meansfor simultaneously conditioning differential and common mode energy;means for decoupling differential and common mode energy; and means forpartially suppressing internally generated energy parasitics from saidcircuit conditioning electronic component.
 6. The energy conditioninginterposer for energized circuitry as recited in claim 5, furthercomprising means for simultaneously preventing radiation of portions ofenergy from said energy conditioning interposer while shielding saidenergy conditioning interposer conditioning means from externalelectrical noise.
 7. The energy conditioning interposer for energizedcircuitry as recited in claim 5, further comprising means forsimultaneously shielding said energy conditioning interposer fromexternal electrical noise while reducing mutual inductive couplingbetween said first and second differential electrodes.
 8. The energyconditioning interposer circuit assembly as recited in claim 2comprising: means for simultaneously conditioning differential andcommon mode energy; means for decoupling differential and common modeenergy; and means for partially suppressing internally generated energyparasitics from said at least one pair of differential electrodes. 9.The energy conditioning interposer circuit assembly as recited in claim8, further comprising means for increasing minimization of portions ofopposed energy flux fields between said at least one pair ofdifferential electrodes.
 10. The energy conditioning interposer circuitassembly as recited in claim 8, further comprising: means for minimizinginternal electrical noise of said at least one pair of differentialelectrodes; wherein said minimization of internal electrical noiseprovides a low impedance pathway along said central common electrode andeither said first or said second common electrodes; and wherein said lowimpedance pathway at least partially surrounds one differentialelectrode of said at least one pair of differential electrodes.
 11. Acircuit assembly comprising: an integrated circuit package including anintegrated circuit die; an energy conditioning interposer comprising afirst and second differential conductive energy pathway, a plurality ofcommon conductive energy pathways, wherein said at least one of saidplurality of common conductive energy pathways is positioned above andbelow each of said first and second differential conductive energypathways, and wherein said plurality of common conductive energypathways are electrically interconnected and connected to a metallizedportion of said integrated circuit package; at least one internal energyutilizing load electrically connected to said first and seconddifferential conductive energy pathways; wherein said plurality ofcommon conductive energy pathways and said first and second differentialconductive pathways form a plurality of energy conditioning elements.12. A circuit assembly comprising: at least one integrated circuit chip;an energy conditioning interposer interconnected to said circuit chipcomprising a plurality of substrate layers wherein said plurality ofsubstrate layers are formed in a parallel relationship and include aplurality of interconnected common conductive electrodes, a pluralitydifferential conductive electrodes; said interposer further comprising aplurality of conductive energy pathways formed generally perpendicularto said plurality of substrate layers, wherein said plurality ofconductive energy pathways provide electrical connection to one or moreof said plurality of substrate layers and when energized completes aportion of a system circuitry wherein said plurality substrate layers ofform a plurality of energy conditioning elements.
 13. The circuitassembly as recited in claim 12, wherein the ratio of said commonconductive electrodes to said differential conductive electrodes is 3:2.14. The circuit assembly as recited in claim 12, wherein said interposerfurther comprises means for simultaneously conditioning differential andcommon mode energy; means for decoupling differential and common modeenergy; and means for partially suppressing internally generated energyparasitics from said interposer.
 15. The circuit assembly as recited inclaim 12, wherein said interposer further comprises means forsimultaneously preventing radiation of portions of energy from saidinterposer while shielding said interposer from external electricalnoise.
 16. The circuit assembly as recited in claim 12, furthercomprising means for simultaneously shielding said interposer fromexternal electrical noise while reducing mutual inductive couplingbetween said first and second differential conductive electrodes.
 17. Anenergy conditioning interposer assembly comprising: at least one pair adifferential conductive electrodes each having at least two conductiveapertures therethrough; at least three common conductive electrodes eachhaving at least two conductive apertures therethrough; wherein eachdifferential conductive electrode is sandwiched by an upper and a lowercommon conductive electrode; wherein each differential conductiveelectrode and each common conductive electrode is positioned within saidinterposer in a generally parallel and stacked orientation andelectrically insulated from each other by a dielectric material; and anouter conductive side surface electrically connected to each said commonconductive electrode such that each said differential conductiveelectrode is shielded by said common conductive electrodes and saidouter conductive side surface through which conductive pathways orientedgenerally perpendicular to said differential conductive electrodeprovide connection to an external electrical circuit through said atleast two conductive apertures; wherein said common conductiveelectrodes, said outer conductive side surface, and said at least onepair of differential electrodes form a plurality of energy conditioningelements.
 18. The energy conditioning interposer assembly as recited inclaim 17, wherein at least a first conductive aperture of said at leasttwo conductive apertures is electrically connected to a firstdifferential electrode of said at least one pair of differentialelectrodes, wherein at least a second conductive aperture of said atleast two conductive apertures is electrically connected to a seconddifferential electrode of said at least one pair of differentialelectrodes.
 19. The energy conditioning interposer assembly as recitedin claim 17, wherein said common conductive electrodes and saiddifferential electrodes each include at least three conductive aperturestherethrough, wherein at least a first conductive aperture of said atleast three conductive apertures is electrically connected to a firstdifferential electrode of said at least one pair of differentialelectrodes, wherein at least a second conductive aperture of said atleast three conductive apertures is electrically connected to a seconddifferential electrode of said at least one pair of differentialelectrodes, and wherein at least a third conductive aperture of said atleast three conductive apertures is electrically connected to eachcommon conductive electrode.
 20. A circuit assembly including aninterposer assembly substantially as described herein with reference toand as illustrated by the accompanying drawings.